Intern, Reliability and Inspection - Summer 2027 at Corning | Corning, NY, US | Rezi

Intern, Reliability and Inspection - Summer 2027 at Corning

Intern, Reliability and Inspection - Summer 2027

Corning · Corning, NY, US

Today

Intern, Reliability and Inspection - Summer 2027

Corning · Corning, NY, US

21 hours ago
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About the Role

The Summer 2027 intern will support the development and validation of laboratory methods to detect and characterize small defects in brittle materials and multi-material structures. This involves understanding how these defects form during reliability stresses and how they can be detected through inspection, establishing the capabilities and limitations of each detection method in relation to failure mechanisms.

Responsibilities

  • Review literature on non-destructive evaluation, acoustic emission and ultrasonic sensing, optical inspection, and reliability mechanisms in brittle materials and electronic packaging.
  • Plan and run experiments, including building and calibrating sensors, data acquisition systems, and test or inspection setups.
  • Apply acoustic emission or other ultrasonic methods to detect, locate and time damage during thermal cycling and other reliability-related stressors.
  • Commission and apply a laboratory imaging system, including automated image analysis and machine vision for defect detection.
  • Acquire, process and analyze sensor waveforms and image data using MATLAB, Python or similar data-analysis tools.
  • Correlate detected events with independent ground truth from microscopy, sectioning, materials characterization and failure analysis; quantify detection thresholds, noise and false calls, and identify which damage mechanisms can and cannot be detected.
  • Use collected data to help calibrate physics-based modeling predictions and develop empirical reliability predictions and associated models.
  • Document methods so others can repeat them, follow laboratory safety practices, and communicate findings clearly in written reports and presentations.

Requirements

  • Currently pursuing a graduate degree (PhD preferred) in mechanical, materials, reliability, electrical or computer engineering, applied physics, optics, or a closely related field.
  • Research, coursework, or hands-on laboratory experience in at least one of: acoustic emission, ultrasonics or non-destructive evaluation; optical imaging or machine vision; reliability testing, life modeling or failure analysis.
  • Experience with signal or image processing using MATLAB, Python or similar tools.
  • Ability to follow laboratory safety procedures, experimental protocols, and data-documentation practices.
  • Strong analytical and problem-solving skills, with attention to detail and a willingness to learn new hands-on laboratory techniques.
  • Ability to organize, analyze, and communicate experimental results clearly in written and verbal formats.
  • Ability to work collaboratively with scientists and engineers while independently completing assigned tasks.
  • Must be available for 10 weeks during Summer 2027 (May-August 2027) with a graduation date of December 2027 or later.
  • Be interested in working for Corning, Inc after graduation, if presented with a full-time job opportunity.
  • Be willing to work at the posted job location.

Skills

  • Non-destructive evaluation
  • Acoustic emission
  • Ultrasonic sensing
  • Optical inspection
  • Reliability mechanisms
  • Brittle materials
  • Electronic packaging
  • MATLAB
  • Python
  • Signal processing
  • Image processing
  • Machine vision
  • Physics-based modeling
  • Empirical reliability predictions
  • Microscopy
  • Sectioning
  • Materials characterization
  • Failure analysis
  • PhD research in non-destructive evaluation, acoustics/ultrasonics, or imaging, applied to reliability of electronics and semiconductor packaging.
  • Acoustic emission sensors, waveguides, source location, waveform feature extraction, or laser vibrometry.
  • Cameras, optics, motion stages or automated inspection systems, including machine-learning-based image analysis.
  • Reliability testing of electronics or semiconductor packages, such as thermal cycling or environmental stress testing.
  • Brittle materials, glass, fracture mechanics, or thermal-mechanical modeling.
  • Experimental design
  • Statistical data analysis
  • Technical literature review

Location

  • Posted job location

Work Type

  • Internship
  • Full-time

Experience Level

  • Graduate student

Education Level

  • Graduate degree (PhD preferred)

Salary/Compensations

  • $1,635.00 - $3,185.00 biweekly

Benefits

  • Competitive salaries
  • Housing assistance
  • Travel reimbursement
  • Social and networking events
  • Volunteer opportunities
  • Community Involvement

About the Company

  • Corning is one of the world’s leading innovators in glass, ceramic, and materials science.
  • Technologies push the boundaries of what’s possible.
  • Company built on breakthroughs.
  • Endless possibilities for making an impact: connect the unconnected, drive the future of automobiles, transform at-home entertainment, and ensure the delivery of lifesaving medicines.

Equal Opportunity

  • This position does not support immigration sponsorship.
  • We prohibit discrimination on the basis of race, color, gender, age, religion, national origin, sexual orientation, gender identity or expression, disability, veteran status or any other legally protected status.
  • Corning is committed to providing equal employment opportunities and considers requests for reasonable accommodations in accordance with applicable laws.
  • Individuals with disabilities or sincerely held religious beliefs may request reasonable accommodations to participate in the application or interview process, perform essential job functions, or access other benefits and privileges of employment.
  • To submit a request for reasonable accommodation related to disability or religion, please contact us at accommodations@corning.com.