Science & Technology - HPC DevOps Engineer Intern - Summer 2027 at Corning | Corning, NY, US | Rezi

Science & Technology - HPC DevOps Engineer Intern - Summer 2027 at Corning

Science & Technology - HPC DevOps Engineer Intern - Summer 2027

Corning · Corning, NY, US

Today

Science & Technology - HPC DevOps Engineer Intern - Summer 2027

Corning · Corning, NY, US

12 hours ago
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About the Role

The HPC DevOps Engineer Intern will support the development and maturation of cloud-bursting capabilities for the organization’s HPC environment. The intern will help build and refine Infrastructure as Code templates and CI/CD workflows using AWS, Terraform/OpenTofu, GitLab CI/CD, SLURM, and Python/Bash, with a focus on advancing an existing development implementation toward Corporate IT production standards.

Responsibilities

  • Collaborate with Scientific Computing staff to enhance existing Infrastructure as Code (IaC) templates supporting HPC cloud-bursting capabilities.
  • Develop, test, and document new automation workflows and features for provisioning and operating burst-to-cloud HPC resources.
  • Assist with GitLab CI/CD pipeline development, testing, and maintenance for IaC and supporting automation.
  • Write and maintain Python and Bash scripts for deployment automation, configuration management, validation, and operational tasks.
  • Support integration of AWS services, Terraform/OpenTofu, and SLURM scheduling components within the HPC bursting environment.
  • Participate in code reviews, testing, troubleshooting, and technical documentation to help advance the solution toward Corporate IT production standards.

Requirements

  • Pursuing a Bachelor's degree in Computer Science, or Software Engineering.
  • Familiarity with Linux/Unix operating systems and command-line tools.
  • Basic scripting or programming experience with Python, Bash, or a similar language.
  • Understanding of software development fundamentals, including version control and collaborative development practices.
  • Experience with or willingness to learn Git and GitLab, including branching, merge requests, and CI/CD concepts.
  • Basic understanding of cloud computing concepts; familiarity with AWS services is preferred.
  • Interest in Infrastructure as Code and automation tools such as Terraform or OpenTofu.
  • Familiarity with HPC concepts, Linux-based compute environments, job schedulers, or SLURM is beneficial.
  • Ability to troubleshoot technical issues, learn new tools independently, and document work clearly.
  • Strong communication and teamwork skills, with the ability to collaborate effectively with Scientific Computing staff.
  • Current enrollment in an undergraduate or graduate program in computer science, computer engineering, information technology, data science, or a related technical field.
  • Must be available for 10 weeks during Summer 2027 (May-August 2027) with a graduation date of December 2027 or later.
  • Be interested in working for Corning, Inc after graduation, if presented with a full-time job opportunity.
  • Be willing to work at the posted job location.

Skills

  • Linux/Unix operating systems
  • Command-line tools
  • Python scripting
  • Bash scripting
  • Git
  • GitLab
  • CI/CD concepts
  • AWS services
  • Terraform
  • OpenTofu
  • SLURM
  • HPC concepts
  • Linux-based compute environments
  • Job schedulers
  • Troubleshooting
  • Technical documentation
  • Communication
  • Teamwork
  • Administering or developing for Linux-based HPC environments
  • Networking fundamentals
  • Security fundamentals
  • VPC design
  • Security groups
  • IAM roles/policies
  • SSH
  • Containers
  • Apptainer/Singularity
  • Docker
  • Generative AI-assisted development tools

Location

  • Posted job location

Work Type

  • Intern

Experience Level

  • Intern

Education Level

  • Bachelor's degree in Computer Science, or Software Engineering
  • Undergraduate or graduate program in computer science, computer engineering, information technology, data science, or a related technical field

Salary/Compensations

  • $1,635.00 - $3,185.00 biweekly

Benefits

  • Competitive salaries
  • Housing assistance
  • Travel reimbursement
  • Social and networking events
  • Opportunities to volunteer
  • Community involvement

About the Company

  • Corning is one of the world’s leading innovators in glass, ceramic, and materials science.
  • Our technologies push the boundaries of what’s possible.
  • At Corning, there are endless possibilities for making an impact. You can help connect the unconnected, drive the future of automobiles, transform at-home entertainment, and ensure the delivery of lifesaving medicines.

Equal Opportunity

  • We prohibit discrimination on the basis of race, color, gender, age, religion, national origin, sexual orientation, gender identity or expression, disability, veteran status or any other legally protected status.
  • Corning is committed to providing equal employment opportunities and considers requests for reasonable accommodations in accordance with applicable laws.
  • Individuals with disabilities or sincerely held religious beliefs may request reasonable accommodations to participate in the application or interview process, perform essential job functions, or access other benefits and privileges of employment.
  • To submit a request for reasonable accommodation related to disability or religion, please contact us at accommodations@corning.com.