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About the Role

Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing. With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more.

Responsibilities

Drive material formulation, characterization, and process optimization through structured Design of Experiments (DOE), data analysis, and root-cause investigations.
Design and execute experiments to evaluate material properties, process performance, reliability, and compatibility with advanced packaging technologies, including 2.5D/3D integration, heterogeneous and mixed material integration, and hybrid bonding.
Lead material qualification and performance validation, and qualification of innovative material solutions for advanced semiconductor packaging applications.
Collaborate with cross-functional teams, including process engineering, equipment development, manufacturing, and external partners, to integrate new materials into semiconductor packaging processes.
Serve as a technical subject matter expert, engaging with customers, suppliers, and industry partners to translate technical requirements into material specifications, development roadmaps, and commercially viable solutions.
Able to work in a team environment, mentor junior engineers / students and communicate effectively.
Other duties as assigned.

Requirements

Bachelor’s degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline and two years of experience in semiconductor packaging industry or a closely related industry, or Master’s degree or higher in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline (for Senior Engineer level).
Bachelor’s degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline and five years of experience in semiconductor packaging industry or a closely related industry, or Master’s degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline, and three years of experience in semiconductor packaging industry or a closely related industry, or Ph.D. higher in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline (for Staff Engineer level).
Experience in semiconductor packaging industry or a closely related industry.
Prior hands-on experience in semiconductor packaging materials development, process integration, or related manufacturing technologies, with a solid understanding of industry requirements and technical challenges.
Strong understanding of advanced semiconductor packaging architectures and technologies, including 2.5D/3D integration, heterogeneous integration, chiplets, wafer-level packaging, and hybrid bonding.
In-depth knowledge of polymer chemistry, structure-property relationships, adhesion mechanisms, interfacial science, thermal and mechanical properties, and material reliability.
Proficiency in materials characterization and analytical techniques, such as DSC, TGA, DMA, FTIR, TMA, etc and mechanical testing, with the ability to interpret results and establish material-performance relationships.
Demonstrated ability to independently design and execute experiments, apply Design of Experiments (DOE) methodologies, troubleshoot complex technical challenges, and translate research findings into practical engineering solutions.
Relevant education and experience may be substituted as appropriate.
Ph.D. in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline (preferred).
3 or more years of experience in semiconductor packaging industry or a closely related industry (preferred).
Two or more years of experience working on Temporary Bonding and Debonding (TBDB) materials and processes (preferred).
Experience in a startup or research and development (R&D) environment (preferred).
Resume/CV
3 work references with their contact information; at least one reference should be from a supervisor
A criminal history background check will be required for finalist(s) under consideration for this position.
If hired, you will be required to complete the federal Employment Eligibility Verification I-9 form.
You will be required to present acceptable and original documents to prove your identity and authorization to work in the United States.
Documents need to be presented no later than the third day of employment.

Skills

Advanced packaging
Semiconductor manufacturing
3D Heterogenous Integration
Material formulation
Material evaluation
Process development
Testing and characterization
Design of Experiments (DOE)
Data analysis
Root-cause investigations
2.5D/3D integration
Heterogeneous integration
Mixed material integration
Hybrid bonding
Material qualification
Performance validation
Cross-functional collaboration
Technical subject matter expertise
Customer engagement
Supplier engagement
Industry partner engagement
Technical requirement translation
Material specification development
Development roadmap creation
Commercially viable solution development
Teamwork
Mentoring
Effective communication
Polymer chemistry
Structure-property relationships
Adhesion mechanisms
Interfacial science
Thermal properties
Mechanical properties
Material reliability
Materials characterization
Analytical techniques (DSC, TGA, DMA, FTIR, TMA)
Mechanical testing
Troubleshooting complex technical challenges
Temporary Bonding and Debonding (TBDB) materials and processes
Keyboard use
Mouse use

Location

AUSTIN, TX

Work Type

On-site
Full-time

Experience Level

Senior Engineer
Staff Engineer

Education Level

Bachelor’s degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline
Master’s degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline
Ph.D. in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline

Salary/Compensations

Industry Competitive Salaries

Benefits

Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

About the Company

The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, pre-eminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions.
Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.
UT Austin, recognized by Forbes as one of America’s Best Large Employers, provides outstanding employee benefits and total rewards packages.

Equal Opportunity

The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action.
The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.