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About the Role
As part of Micron's Technology Development (R&D) organization, you will develop innovative thin-film and materials solutions for future memory technologies. You will apply deep technical expertise to solve semiconductor integration challenges and advance new concepts toward manufacturable technology.
Responsibilities
- Develop innovative thin-film and materials solutions for advanced DRAM architectures, patterning, and emerging integration schemes.
- Translate semiconductor device and integration requirements into film properties and manufacturable process solutions.
- Build, optimize, and characterize advanced thin-film deposition processes.
- Advance new materials and processes from technical feasibility through semiconductor integration and demonstration on relevant test vehicles.
- Design and implement rigorous experiments and DOEs; apply data-driven and AI-enabled methods to analyze results, optimize processes, and resolve material, defectivity, yield, and reliability challenges.
- Partner with process integration, patterning, etch, metrology, equipment, device, and supplier teams to evaluate new materials and process capabilities.
- Provide technical leadership by defining development strategy, influencing decisions, presenting recommendations, and mentoring engineers across multidisciplinary teams.
Requirements
- PhD/MS or equivalent experience with 3+ years of relevant semiconductor industry experience in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Physics, or a related technical field.
- Demonstrated industry experience in thin-film materials and/or process development for semiconductor applications.
- Experience applying thin-film, materials, surface science, deposition, or process-integration fundamentals to semiconductor development challenges.
- Experience designing and analyzing experiments using DOE and data-driven methods to develop or optimize materials and processes.
- Proven ability to independently drive complex technical work and communicate recommendations across multidisciplinary teams.
Skills
- CVD
- PECVD
- ALD
- PEALD
- plasma-enhanced deposition
- advanced thin-film technologies
- memory
- logic
- HPC/CMOS
- semiconductor technologies
- EUV
- patterning-enabling films
- hard masks
- underlayers
- spacer materials
- etch-selective films
- XPS
- AFM
- XRD
- ellipsometry
- TEM/SEM
- SIMS
- thin-film characterization
- surface characterization
Location
- Albany, NY
Work Type
- Full-time
Experience Level
- 3+ years of relevant semiconductor industry experience
- Principal
Education Level
- PhD/MS or equivalent experience
Salary/Compensations
- $111,000.00 - $190,000.00 a year
Benefits
- Choice of medical, dental and vision plans
- Benefit programs that help protect your income if you are unable to work due to illness or injury
- Paid family leave
- Robust paid time-off program
- Paid holidays
About the Company
- Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
- As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.
Equal Opportunity
- Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
- Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
- Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.