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About the Role
We are seeking a PCB / Package Design Engineer to join our global team, driving the development of SoC products for industrial equipment and physical AI. This role is crucial for optimizing the entire system, including SoC, Package, and PCB, to ensure cost competitiveness and technological superiority in advanced semiconductor development.
Responsibilities
- PCB and Package design for SoC products for industrial equipment and physical AI.
- Feasibility study and design of PCB/Package for SoC products with high-speed memory interfaces such as DDR4, DDR5, LPDDR4, and LPDDR5.
- Feasibility study and design of PCB/Package for SoC products with high-speed interfaces/SerDes such as PCI Express, USB 3.x, and Ethernet PHY.
- Feasibility study of PCB/Package for next-generation SoC products equipped with LPDDR6.
- Board design and RDL design for a wide range of packages, from multi-pin FCBGA and Wire Bond BGA to QFN and WLCSP, including electrical characteristic and EMC verification.
- PCB power design for SoC products, and Signal Integrity (SI)/Power Integrity (PI) analysis and verification.
- Collaboration with global development teams, including SoC HW design and Validation teams, and promotion of co-design for SoC/Package/PCB.
Requirements
- Practical experience in PCB and Package design using Cadence design tools.
- Experience in extracting and analyzing S-parameters and RLC parameters using electromagnetic field analysis tools such as Ansys from PCB/Package design data.
- Experience in Signal Integrity (SI)/Power Integrity (PI) analysis and verification using circuit simulations such as SPICE with extracted S-parameters and RLC parameters.
- Ability to communicate smoothly with global development teams and promote development through collaboration with related departments.
- Ability to identify issues independently and promote work proactively and autonomously.
Skills
- PCB design
- Package design
- High-speed memory interface design (DDR4, DDR5, LPDDR4, LPDDR5)
- High-speed interface design (PCI Express, USB 3.x, Ethernet PHY)
- LPDDR6
- FCBGA
- Wire Bond BGA
- QFN
- WLCSP
- RDL design
- Electrical characteristic verification
- EMC verification
- PCB power design
- Signal Integrity (SI) analysis
- Power Integrity (PI) analysis
- Cadence design tools
- Ansys
- SPICE
- Altium Designer
- Siemens HyperLynx
- RF function design
- 3D electromagnetic field analysis
Location
- Global
Work Type
- Regular (PERM)
- Onsite
Experience Level
- Professional
Benefits
- Competitive compensation
- Comprehensive benefits package
About the Company
- Renesas is a global company providing embedded semiconductor solutions with the purpose of 'To Make Our Lives Easier'. We contribute to creating a safer, healthier, more environmentally friendly, and smarter future by engaging in world-leading technology development in automotive, industrial, infrastructure, and IoT fields with over 21,000 engineers and problem-solving professionals working in more than 30 countries.
- Renesas' core corporate culture is 'TAGIE (Transparent, Agile, Global, Innovative, Entrepreneurial)'. TAGIE is a set of common values that support our way of working, growing, and pursuing our Purpose. This collaborative spirit and challenging mindset enable us to transform industries through semiconductor technology and contribute to people's lives worldwide.
- We offer a competitive compensation system and a comprehensive benefits package. Details of the benefits will be provided during the selection process.