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About the Role

Lead a multidisciplinary team of approximately 10–20 engineers developing advanced cryogenic CMOS ICs and reusable design solutions. This role provides technical and people leadership across the complete IC development lifecycle, from architecture and circuit design through verification, tapeout, silicon characterization, and design-to-silicon correlation. The manager will provide technical direction, organizational leadership, and execution ownership while working closely with technology development, PDK, compact modeling, test, packaging, design enablement, customers, and ecosystem partners.

Responsibilities

Lead and manage a multidisciplinary CryoCMOS IC design team of approximately 10–20 engineers, establishing technical direction, priorities, resource plans, and execution strategy across analog, RF, digital, mixed-signal, and physical design disciplines.
Drive end-to-end development of CryoCMOS ICs and reusable design IP, from system and circuit architecture through design, simulation, physical implementation, verification, tapeout, silicon bring-up, and characterization.
Provide technical leadership for complex IC development, including architecture and design reviews, design methodology, performance optimization, design closure, technical risk identification, and resolution of critical design issues.
Develop differentiated IC solutions, reusable IP, design methodologies, and enablement capabilities that leverage GF process technologies for cryogenic, quantum, and other advanced applications.
Partner with PDK, compact modeling, technology development, test, packaging, and design enablement teams to translate process technology capabilities into robust, manufacturable IC solutions and identify design or modeling gaps.
Establish and continuously improve IC design processes, technical review mechanisms, quality standards, and execution metrics to enable predictable delivery and successful tapeouts.
Build and develop a high-performing engineering organization through recruiting, coaching, technical mentorship, performance management, succession planning, and development of future technical leaders.
Collaborate with internal stakeholders, customers, and ecosystem partners to translate system requirements and technology opportunities into design roadmaps, IC architectures, and executable development programs.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Work and collaborate on other projects and/or assignments as needed.

Requirements

Bachelor's degree in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related technical field.
Minimum 10 years of relevant semiconductor IC design experience, including progressively increasing technical leadership responsibilities.
Demonstrated experience successfully leading and managing IC design teams, preferably multidisciplinary teams spanning analog, mixed-signal, RF, digital, and/or physical design.
Demonstrated experience leading complex IC development through architecture, design, verification, physical implementation, tapeout, silicon bring-up, characterization, and design-to-silicon correlation.
Strong understanding of CMOS IC design, semiconductor devices, design methodologies, physical implementation, verification, PVT variation, parasitic effects, and silicon characterization.
Demonstrated ability to manage multiple complex IC development activities, prioritize engineering resources, mitigate technical and program risks, and deliver against schedule.
Demonstrated ability to recruit, develop, coach, and retain high-performing engineering teams and technical leaders.
Ability to communicate complex technical topics, priorities, risks, and recommendations effectively across engineering teams, customers, management, and senior leadership.
Up to 10% travel.
Fluency in English Language: Written and verbal.
Master's degree or PhD in Electrical Engineering, Microelectronics, Computer Engineering, Applied Physics, or a related field.
Experience leading IC design organizations of 10 or more engineers, including multidisciplinary analog, RF, mixed-signal, digital, and/or physical design teams.
Experience with cryoCMOS, quantum-control/readout electronics, low-temperature electronics, or other advanced semiconductor applications.
Deep technical expertise in at least one IC design discipline, such as analog/mixed-signal, RFIC, digital IC, or high-speed circuit design, combined with sufficient technical breadth to lead multidisciplinary IC development.
Experience working closely with semiconductor technology development, PDK, compact modeling, EDA, test, packaging, and silicon characterization teams.
Experience establishing or scaling an IC design capability, including design methodologies, reusable IP, design flows, technical review processes, and tapeout execution practices.
Experience engaging customers and ecosystem partners to translate system-level requirements into semiconductor technology and IC design solutions.
Project management skills, including the ability to innovate and execute on solutions that matter and navigate ambiguity.
Strong written and verbal communication skills.
Strong planning and organizational skills.

Skills

Analog IC design
RF IC design
Digital IC design
Mixed-signal IC design
Physical design
CMOS IC design
Semiconductor devices
Design methodologies
Physical implementation
Verification
PVT variation
Parasitic effects
Silicon characterization
CryoCMOS
Quantum-control/readout electronics
Low-temperature electronics
Analog/mixed-signal design
RFIC design
Digital IC design
High-speed circuit design
PDK
Compact modeling
EDA
Test
Packaging
Silicon characterization
Project management

Location

Global

Work Type

Full-time

Experience Level

10+ years semiconductor IC design experience
Progressively increasing technical leadership responsibilities
Experience leading IC design organizations of 10 or more engineers

Education Level

Bachelor's degree in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related technical field
Master's degree or PhD in Electrical Engineering, Microelectronics, Computer Engineering, Applied Physics, or a related field

Salary/Compensations

$166,500.00 - $319,000.00

Benefits

Environmental, Health, Safety & Security programs

About the Company

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies.
With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.

Equal Opportunity

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential.
GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people.
Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law.