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About the Role

Own the execution of Renesas’ strategic AI/Datacenter Infrastructure Power package engineering and New Product Introduction (NPI) programs, from development and qualification through production ramp, in a fast-paced, high-growth environment. You will collaborate with product Technical Program Managers (TPMs) and personnel embedded at key global OSATs, to deliver committed schedules and quality, reliability, and production-readiness objectives.

Responsibilities

Lead Technical Program Management execution for strategic AI/Datacenter Infrastructure Power NPI and package engineering programs, directly managing complex programs as needed.
Partner with Package Engineering Directors and technical leads, providing program-level execution leadership, governance, and accountability while keeping technical ownership clear and unduplicated.
Establish and drive end-to-end NPI program plans, milestones, critical paths, and resource alignment to achieve committed schedules.
Establish a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing.
Continuously improve standardized processes, templates, metrics, escalation mechanisms, and lessons-learned practices, and drive consistent execution standards across internal teams and strategic OSAT locations.
Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks and establish mitigation plans.
Escalate critical issues with clear recommendations and decision points.
Lead cross-functional technical task forces, collaborating closely with internal teams and external partners (OSAT/CM, customers), on issues that threaten quality, reliability, yield, manufacturability, qualification, schedule, or customer commitments, including process-integration and assembly problems.
Drive root-cause analysis and data-based decisions, and hold corrective/preventive actions through to closure.
Coordinate closely with Power product group partners (Design, Application, Marketing), Product Engineering, Reliability, Quality, Operations, and Supply Chain to remove execution barriers and maintain program momentum.
Establish program dashboards and management systems giving transparent visibility into milestones, critical path, risks, issues, action owners, and recovery plans.
Collaborate and drive key OSAT/CM partners through program reviews, milestone tracking, issue escalation, and recovery plans.
Ensure Engineering Build Requests (EBRs) are executed on committed schedule at each OSAT, tracking progress, identifying delays, and driving recovery actions.
Align OSAT/CM development activities (DOE, process optimization, process-window verification, production controls) and qualification and ramp readiness with overall NPI program objectives.
Build strong working relationships with OSAT/CM executive and technical leadership to improve responsiveness, accountability, and execution of critical AI/Datacenter Power programs.
Ensure effective transition from development and qualification into production through readiness reviews, ramp monitoring, and issue management.
Provide concise, fact-based communication to directors and senior leadership on program health, critical risks, schedule recovery, resource needs, and decisions required.
Support package technology roadmap execution by translating strategic priorities into executable programs, milestones, resources, and deliverables.
Translate organizational priorities into team objectives, staffing recommendations, performance expectations, and development plans.
Foster a culture of urgency, fact-based decision making, cross-functional collaboration, ownership, and rapid issue resolution.

Requirements

Bachelor’s degree or higher in Electrical, Mechanical, Chemical, or Materials Engineering; Materials Science; Physics; Chemistry; or a related technical discipline.
12+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field, including experience leading complex cross-functional programs.
Demonstrated experience managing complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
Strong understanding of semiconductor product development process, package and assembly processes.
Hands-on experience in Power Management products, particularly with several of these: power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management system, PMICs, wafer-level and/or flip-chip technologies.
Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.
Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule.
Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.
Strong program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.
Strong interpersonal, communication, negotiation, and presentation skills, including the ability to communicate effectively with senior leaders.
Ability to influence technical and business leaders without direct authority and drive accountability across organizational boundaries.
Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions.
Willingness to travel domestically and/or internationally approximately 10–20% of the time, including to OSAT/CM sites.
Experience supporting high-growth, high-visibility customer programs.
Familiarity with wide-bandgap (SiC/GaN) devices, power-module substrates (DBC/AMB), multi-chip, or advanced interconnect technologies
Experience with formal technical program management methodologies and portfolio-level governance.
Experience driving customer-critical NPI programs in a fast-paced, high-growth environment.

Skills

AI/Datacenter Infrastructure Power package engineering
New Product Introduction (NPI)
Technical Program Management (TPM)
Package Engineering
Power product group teams
OSAT/CM partners
Cross-functional technical task forces
Process-integration
Assembly problems
Root-cause analysis
Data-based decisions
Corrective/preventive actions
Product Engineering
Reliability
Quality
Operations
Supply Chain
Program dashboards
Management systems
Milestone tracking
Issue escalation
Recovery plans
Engineering Build Requests (EBRs)
DOE
Process optimization
Process-window verification
Production controls
Qualification
Ramp readiness
NPI program objectives
Semiconductor engineering
Product development
Applications
Package development
Manufacturing
Technical program management
Semiconductor NPI programs
Package development
Assembly
Qualification
Reliability
Manufacturing ramp
Semiconductor product development process
Package and assembly processes
Power Management products
Power SiP/modules
Smart Power Stages
Vertical Power Stages
Power Modules
Discrete FET packages
Battery management system
PMICs
Wafer-level technologies
Flip-chip technologies
OSATs/CMs
Development activities
Production activities
Quality issues
Reliability issues
Yield issues
Manufacturability issues
Schedule issues
Qualification
Reliability
SPC/statistical methods
Process development
Risk management
Structured problem-solving methodologies
Program management
Critical-path management
Risk management
Executive escalation
Schedule recovery
Cross-functional resource alignment
Interpersonal skills
Communication skills
Negotiation skills
Presentation skills
Influencing technical leaders
Influencing business leaders
Driving accountability
Analytical skills
Translating complex technical issues
Business impact
Decision making
Action planning
High-growth programs
High-visibility customer programs
Wide-bandgap (SiC/GaN) devices
Power-module substrates (DBC/AMB)
Multi-chip technologies
Advanced interconnect technologies
Formal technical program management methodologies
Portfolio-level governance
Customer-critical NPI programs

Location

Globally distributed organizations

Work Type

Regular (PERM)
Full-time

Experience Level

12+ years of relevant experience
Experience leading complex cross-functional programs
Demonstrated experience managing complex semiconductor NPI programs
Hands-on experience
Experience working with OSATs/CMs
Proven track record
Experience supporting high-growth, high-visibility customer programs
Experience with formal technical program management methodologies
Experience driving customer-critical NPI programs

Education Level

Bachelor’s degree or higher in Electrical, Mechanical, Chemical, or Materials Engineering; Materials Science; Physics; Chemistry; or a related technical discipline.

Benefits

Medical
Health savings account (with applicable medical plan)
Dental
Vision
Health and/or dependent care flexible spending accounts
Pre-tax commuter benefits
Life insurance
AD&D
Pet insurance
Company-paid life insurance
Company-paid AD&D
LTD
Short term medical benefits
Paid sick time
Paid holidays
Accrued paid vacation

About the Company

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier.
With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together.
This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

Equal Opportunity

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law.
For more information, please read our Diversity & Inclusion Statement.