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About the Role

As a Staff PCB Designer at Qualcomm, you will be a key contributor shaping next-generation hardware from concept through fabrication. You will work alongside world-class electrical and mechanical engineering teams on cutting-edge printed circuit boards across Qualcomm's most strategic platforms, including DataCenter, Server, Connectivity, Compute, and R&D.

Responsibilities

Design and document high-density printed circuit board (PCB) layouts that conform to manufacturing and industry standards and Qualcomm design guidelines, using supplied schematics and electrical/mechanical design constraints.
Develop PCB layouts for a wide variety of Data Center / Server and Connectivity designs across multiple business units, including R&D, Data Center, Connectivity and Compute.
Support form factor accurate (FFA) test platform circuit boards requiring mastery of AI Inference and High level Compute processors, RF, radio circuits, and power control devices.
Work with micro-vias (stacked), sequential lamination stack-ups, and design rules using 0.5mm pitch and smaller packages.
Collaborate with US and India-based teams to deliver PCB design solutions for high-performance electronic assemblies.
Develop and present PCB design trade-offs and solutions to the engineering design team for resolution and implementation.
Determine trade-offs necessary to meet design requirements while producing high-quality, cost-effective PCBs that meet schedule objectives.
Maintain technical coordination with Engineering and Manufacturing; resolve PCB design issues with fabrication and assembly vendors.
Prepare and deliver design reviews to project teams.
Contribute to process improvement initiatives, PCB and DFM checklists, and design guidelines.
Collaborate with internal PCB designers to optimize product development processes and schedule execution.
Provide direction, prioritization, and clear project task communication to team members and stakeholders.
Manage multiple projects simultaneously in a fast-paced, dynamic environment.

Requirements

5+ years of active experience in PCB design for high-density electronics packaging.
5+ years of experience in a PCB design role designing consumer-grade mobile products or low-volume test products utilizing latest-generation processor chips and ICs.
Proficiency in Siemens/Mentor Xpedition, PADS, Altium or Cadence Allegro PCB design software.
Associate’s degree in Electronics, Electrical Technology, or a related technical field.
Experience with RF, Analog, and high-speed digital circuit design, including: DDR2/3/4/5, HDMI, PCIe Gen5/6, SATA, 224G SerDes, MIPI, USB 2.0/3.x, and GigE.
Expert understanding and demonstrated application of PCB design principles, practices, and industry standards.
Proven ability to perform complex PCB design tasks requiring in-depth knowledge of fabrication and assembly process capabilities and limitations.
Experience with EMI mitigation techniques and practices.
Experience with IDF/EMN file exchange between mechanical and hardware teams.
Familiarity with PWB technology and process trends and their application to advanced designs.
Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
Strong verbal and written communication skills; ability to deliver clear status reports and presentations.
Effective collaboration with cross-functional engineering teams and external suppliers via email, web meetings, and instant messaging.
Ability to understand project goals and align individual contributions accordingly.
Leadership skills to direct, prioritize, and communicate project milestones to team members.
Associate degree in Electrical Engineering, Computer Science, Mathematics, or related field and 7+ years of PCB layout handling or related work experience.
High School diploma or equivalent and 9+ years of PCB layout handling or related work experience.

Skills

PCB design
Siemens/Mentor Xpedition
PADS
Altium
Cadence Allegro PCB design software
RF
Analog
High-speed digital circuit design
DDR2/3/4/5
HDMI
PCIe Gen5/6
SATA
224G SerDes
MIPI
USB 2.0/3.x
GigE
EMI mitigation techniques
IDF/EMN file exchange
PWB technology
DFM analysis
Valor
CAM350 tools
Communication skills
Collaboration
Leadership skills

Location

Austin, Texas

Work Type

Full-time
Onsite

Experience Level

Staff
5+ years
7+ years
9+ years

Education Level

Associate degree in Electronics, Electrical Technology, or a related technical field
Associate degree in Electrical Engineering, Computer Science, Mathematics, or related field
High School diploma or equivalent
Bachelor’s degree in electrical engineering, electronics engineering technology, or a related technical field

Salary/Compensations

$57.70 - $86.50

Benefits

Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package

About the Company

Qualcomm is a company of inventors that unlocked 5G & 6G, ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives.
The Central Hardware Systems (CHS) PCB CAD team designs cutting-edge printed circuit boards across Qualcomm's most strategic platforms — spanning DataCenter, Server, Connectivity, Compute, and R&D.

Equal Opportunity

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm is committed to providing an accessible process for individuals with disabilities and making our workplace accessible for individuals with disabilities.