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About the Role
We are seeking technical program managers to lead programs for our wafer-scale photonic systems. This hands-on role involves owning the schedule, risks, and inter-team handoffs, while actively participating in technical details alongside engineers. The ideal candidate is a proactive individual who drives tasks to completion rather than just tracking status.
Responsibilities
- Own the schedule, risks, and handoffs between teams.
- Work in the technical details alongside engineers.
- Get things done themselves, not just track status.
- Build plans and schedules that engineers use and drive them to completion.
- Run work with external partners (foundries, OSATs, IP or design-services vendors).
Requirements
- 8+ years in semiconductor or hardware development (as an engineer, program manager, or both).
- Experience taking programs from development to working hardware.
- Deep working knowledge of advanced packaging and assembly, or ASIC/SoC and system hardware.
- Clear and direct communication with engineers, partners, and leadership.
- Ability to read specifications closely and identify gaps, conflicts, and missing owners.
Skills
- Advanced packaging (2.5D/3D, chiplet, flip chip), including complex multi-die packages
- Chip-on-wafer (CoW) assembly, including mechanical stress and thermal effects
- Photonic, optoelectronic or other heterogeneous-material assemblies
- Reliability qualification, failure analysis, test vehicles and DOEs
- Advanced-node ASIC/SoC tape-outs and work with third-party IP or design-services partners
- Multi-die, chiplet or MCM programs, including chip-package co-design
- System hardware (boards, power, thermal, mechanical) through bring-up
- Optical I/O or high-speed SerDes programs
- Data-center or OCP-style hardware
- Jira and Confluence
Experience Level
- 8+ years