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About the Role

Serve as a key technical interface for strategic customers, driving new technology introduction and successful customer adoption of PEALD metal oxide and metal nitride processes. This role combines deep thin-film process expertise, plasma process understanding, and strong customer engagement to support NPI, demos, JDP/PTOR/DTOR activities, process qualification, HVM ramp, and technical escalations.

Responsibilities

Act as the primary technical interface for key customers, supporting PEALD metal oxide and metal nitride process development, evaluation, qualification, and production while building strong relationships with customer R&D, integration, and manufacturing teams
Drive NPI, demo, JDP, PTOR/DTOR, and HVM support activities at customer sites, leading hands-on deployment and implementing BU-developed BKMs, CIPs, and process improvements
Execute and support customer-specific DOE, process optimization, demo, and trouble-shooting activities for current and other emerging PEALD MXNT materials
Diagnose and resolve complex processes, film-property, integration, and equipment issues across development and production environments, including root cause analysis, corrective actions, particle reduction, thickness/uniformity improvement, and process stability enhancement
Monitor tool and process performance against customer specifications, including film thickness, uniformity, conformality, stress, resistivity, optical properties, thermal properties, particles, throughput, and uptime
Understand customer device roadmaps and integration challenges, and align ASM PEALD MXNT solutions with future node requirements in patterning, hard mask, spacer, liners, CIS optical, thermal management, and emerging memory applications
Collaborate with global R&D, Product Marketing, GPS/TPS, hardware engineering, service, and account teams to drive continuous product improvement and translate customer requirements into product and technology development inputs
Support alignment between customer needs, ASM PEALD MXNT product strategy, and BU1 business priorities while maintaining a strong customer-facing and solution-oriented mindset

Requirements

Ph.D. or Master’s degree in Chemical Engineering, Materials Science and Engineering, Chemistry, Applied Chemistry, Physics, Electrical Engineering, Semiconductor Engineering, or a closely related technical discipline
Strong academic foundation in thin-film deposition, surface chemistry, plasma processing, semiconductor materials, vacuum technology, or semiconductor process integration
Ph.D. with 4-8+ years of relevant industry experience, or Master's degree with 7-10+ years of relevant industry experience
Hands-on experience in ALD or PEALD thin-film deposition, preferably with metal oxide and/or metal nitride films or related materials
Experience in semiconductor device manufacturing, process development, integration, application engineering, or capital equipment industry, preferably supporting logic, memory, foundry, CIS, or advanced packaging customers
Background in roles such as Process Engineer, Integration Engineer, Application Engineer, Key Account Technologist, Field Process Engineer, or Technical Customer Support is highly preferred
Solid understanding of semiconductor process integration, plasma-surface interactions, thin-film characterization, and high-volume manufacturing requirements for advanced technology nodes
Proven ability to solve complex technical problems through data-driven analysis, customer escalation management, structured root cause analysis, corrective action planning, and cross-functional execution
Experience supporting NPI, process qualification, technology transfer, customer demos, or HVM ramp activities at customer sites
Strong analytical skills with experience interpreting process, metrology, and device-relevant data such as thickness, uniformity, conformality, composition, resistivity, stress, refractive index, roughness, particles, and throughput
Strong communication skills to engage effectively with customer R&D, manufacturing, and internal global teams
Fluent in English and Chinese, with the ability to communicate complex technical topics clearly and effectively

Skills

PEALD metal oxide and metal nitride processes
Thin-film process expertise
Plasma process understanding
Customer engagement
NPI
JDP/PTOR/DTOR activities
Process qualification
HVM ramp
Technical escalations
ALD
PEALD thin-film deposition
Metal oxide films
Metal nitride films
Semiconductor device manufacturing
Process development
Integration
Application engineering
Capital equipment
Semiconductor process integration
Plasma-surface interactions
Thin-film characterization
High-volume manufacturing
Data-driven analysis
Customer escalation management
Root cause analysis
Corrective action planning
Cross-functional execution
Technology transfer
Customer demos
Process optimization
Trouble-shooting
DOE
Metrology
Device-relevant data interpretation
English
Chinese

Location

Japan
Korea

Work Type

Full-time

Experience Level

Senior
4-8+ years (Ph.D.)
7-10+ years (Master's)

Education Level

Ph.D.
Master's degree

About the Company

ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible for over 55 years.
With more than 4,500 people representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.
Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
We make the tech that enables the chips in devices which improve lives around the world.
We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

Equal Opportunity

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.