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About the Role
The Microelectronics Assembler performs precision assembly and processing of hybrid thick-film microelectronic components in a Class 10K cleanroom environment. This position involves working with delicate, lightweight components and ceramic substrates using microscopes, precision tools, and specialized manufacturing equipment.
Responsibilities
- Perform precision assembly of hybrid thick-film microelectronic components using microscopes, tweezers, and specialized hand tools.
- Handle extremely lightweight and delicate components with care to prevent damage, contamination, or defects.
- Perform microelectronic assembly processes, including die attach, die bonding, wire bonding, soldering, and epoxy dispensing, as required.
- Print and fire ceramic substrates in support of thick-film circuit manufacturing.
- Operate specialized microelectronics equipment, including wire bonders, dispensing equipment, ovens, and inspection tools.
- Follow detailed work instructions, engineering drawings, process specifications, and manufacturing travelers.
- Inspect components and assemblies under magnification to verify workmanship and conformance to quality requirements.
- Accurately document completed operations, inspection results, and production records.
- Work with engineering and quality personnel to address manufacturing issues and maintain product quality.
- Maintain cleanroom protocols, electrostatic discharge (ESD) controls, and applicable safety requirements.
- Maintain a clean, organized work area and comply with established contamination-control procedures.
- Perform other related manufacturing duties as required.
Requirements
- Ability to perform detailed manual assembly using a microscope and precision hand tools for extended periods.
- Excellent manual dexterity and hand-eye coordination, with the ability to handle extremely small, lightweight, and delicate components.
- Strong attention to detail and commitment to quality workmanship.
- Ability to read and follow detailed work instructions, engineering drawings, and manufacturing documentation.
- Familiarity with ESD controls, cleanroom practices, and precision assembly techniques is preferred.
- Basic computer skills for production documentation and recordkeeping.
- Ability to work independently while contributing to a team-oriented manufacturing environment.
- Willingness to learn specialized processes and equipment.
- Ability to sit or stand for extended periods while performing microscope-assisted assembly.
- Sufficient fine motor control, hand-eye coordination, and visual acuity to perform precision assembly and inspection under magnification.
- Ability to maintain consistent, careful hand movements while working with small, delicate components.
- Work performed in a Class 10K cleanroom and controlled manufacturing environment.
- Required use of cleanroom garments, personal protective equipment (PPE), and ESD protection as applicable.
- Potential exposure to adhesives, solvents, processing chemicals, and heated equipment in accordance with established safety procedures.
- Adherence to cleanliness, contamination control, product handling, and manufacturing process requirements.
Skills
- Microelectronics assembly
- Hybrid circuit manufacturing
- Thick-film processing
- Semiconductor assembly
- Precision manufacturing
- Microscope operation
- Precision hand tools
- Die attach
- Die bonding
- Wire bonding
- Soldering
- Epoxy dispensing
- Substrate printing
- Substrate firing
- Wire bonder operation
- Dispensing equipment operation
- Oven operation
- Inspection tools operation
- Work instruction following
- Engineering drawing interpretation
- Process specification adherence
- Manufacturing traveler adherence
- Quality inspection
- Production documentation
- Recordkeeping
- Cleanroom protocols
- ESD controls
- Safety procedures
- Contamination control
- Manual dexterity
- Hand-eye coordination
- Attention to detail
- Visual acuity
- Teamwork
- Computer skills
Education Level
- High school diploma or equivalent required
- Technical training or certification in electronics or a related field is preferred