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About the Role
Lead semiconductor package design in collaboration with IC design engineers to optimize product cost and performance. Lead the layout design of package substrates and printed circuit boards for reference designs for semiconductor products incorporating high-speed memory interfaces and high-speed serial communication circuits. Investigate technology trends in semiconductor packages and printed circuit boards, and propose and develop design technologies required for next-generation products. Take on a leadership role within the design team as your experience grows.
Responsibilities
- Lead semiconductor package design in collaboration with IC design engineers to optimize product cost and performance.
- Lead the layout design of package substrates and printed circuit boards for reference designs for semiconductor products incorporating high-speed memory interfaces and high-speed serial communication circuits.
- Investigate technology trends in semiconductor packages and printed circuit boards, and propose and develop design technologies required for next-generation products.
- Take on a leadership role within the design team as your experience grows.
Requirements
- Ability to understand the Renesas Culture principles of Transparent, Agile, Global, Innovative, and Entrepreneurial, and act in accordance with these values.
- At least three years of practical experience in semiconductor package design.
- At least three years of practical experience in high-speed or high-frequency electrical design.
- At least three years of practical experience in semiconductor package design at a semiconductor manufacturer.
- At least three years of experience using electromagnetic field simulation tools such as HFSS and Q3D.
- At least three years of experience using high-frequency circuit simulation tools such as ADS and HSPICE.
- At least three years of experience in electrical characterization using VNAs, impedance analyzers, or similar equipment, or in EMC evaluation.
Skills
- Semiconductor package design
- High-speed or high-frequency electrical design
- Electromagnetic field simulation tools (HFSS, Q3D)
- High-frequency circuit simulation tools (ADS, HSPICE)
- Electrical characterization using VNAs, impedance analyzers
- EMC evaluation
Location
- Not specified
Work Type
- Regular (PERM)
- Onsite
Experience Level
- 3+ years in semiconductor package design
- 3+ years in high-speed or high-frequency electrical design
- 3+ years in semiconductor package design at a semiconductor manufacturer
- 3+ years using electromagnetic field simulation tools
- 3+ years using high-frequency circuit simulation tools
- 3+ years in electrical characterization or EMC evaluation
Benefits
- Competitive compensation
- Comprehensive benefits package
About the Company
- Renesas is a global company providing embedded semiconductor solutions, aiming to 'Make Our Lives Easier'. With over 21,000 engineers and problem solvers in more than 30 countries, we contribute to the development of world-leading technologies in automotive, industrial, infrastructure, and IoT fields, realizing a safer, healthier, more environmentally friendly, and smarter future.
- Our corporate culture, TAGIE (Transparent, Agile, Global, Innovative, Entrepreneurial), is at the core of our operations, supporting how we work, grow, and achieve our Purpose. This collaborative spirit and challenging mindset enable us to transform industries through semiconductor technology and contribute to people's lives worldwide.
- We offer competitive compensation and a comprehensive benefits package. Details will be provided during the selection process.
- Join us in creating the future. We look forward to your application.