半導体パッケージ電気設計技術者 at Renesas Electronics | JP | Rezi

半導体パッケージ電気設計技術者 at Renesas Electronics

半導体パッケージ電気設計技術者

Renesas Electronics · JP

3 weeks ago

半導体パッケージ電気設計技術者

Renesas Electronics · JP

22 days ago
Resume preview

Impress employers and recruiters.
Choose from hundreds of resume examples.

Target Resume Now
Resume preview

Tailor your resume to this 半導体パッケージ電気設計技術者 role.

Rezi rewrites your resume against Renesas Electronics's job description. Free.

Resume score gauge reading 58 out of 100

Don't guess if your resume is good enough.

See how it scores against the 半導体パッケージ電気設計技術者 posting at Renesas Electronics — free, in seconds.

About the Role

Lead semiconductor package design, optimizing product cost and performance in collaboration with semiconductor circuit designers. Responsible for pattern design of semiconductor package substrates and printed circuit boards (reference designs) for semiconductor products featuring high-speed memory interface circuits and high-speed serial communication circuits. Investigate technology trends in semiconductor packages and printed circuit boards, proposing and developing necessary design technologies for next-generation products. Future role may involve leading the design team.

Responsibilities

  • Lead semiconductor package design, optimizing product cost and performance in collaboration with semiconductor circuit designers.
  • Perform pattern design of semiconductor package substrates and printed circuit boards (reference designs) for semiconductor products featuring high-speed memory interface circuits and high-speed serial communication circuits.
  • Investigate technology trends in semiconductor packages and printed circuit boards, proposing and developing necessary design technologies for next-generation products.
  • Potentially lead the design team in the future.

Requirements

  • Understand and act based on Renesas culture (Transparent, Agile, Global, Innovation, Entrepreneurial).
  • Minimum 3 years of practical experience in semiconductor package design.
  • Minimum 3 years of practical experience in high-speed electrical design or high-frequency electrical design.

Skills

  • Semiconductor package design
  • High-speed electrical design
  • High-frequency electrical design
  • Semiconductor package substrate design
  • Printed circuit board (reference design) pattern design
  • Electromagnetic field simulation tools (HFSS, Q3D)
  • High-frequency circuit simulation tools (ADS, HSPICE)
  • Electrical characteristic evaluation using VNA, impedance analyzer, etc.
  • EMC evaluation

Location

  • Japan

Work Type

  • Full-time
  • Onsite

Experience Level

  • 3+ years of experience in semiconductor package design
  • 3+ years of experience in high-speed electrical design or high-frequency electrical design

Benefits

  • Competitive compensation package
  • Comprehensive benefits

About the Company

  • Renesas is a global company providing embedded semiconductor solutions with the Purpose of 'To Make Our Lives Easier'.
  • Over 21,000 engineers and problem solvers in more than 30 countries worldwide contribute to world-leading technology development in automotive, industrial, infrastructure, and IoT fields.
  • Contribute to realizing a safer, healthier, environmentally friendly, and smarter future.
  • Renesas' core corporate culture is 'TAGIE' (Transparent, Agile, Global, Innovative, Entrepreneurial), representing shared values that support how we work, grow, and pursue our Purpose.
  • This collaborative spirit and challenging mindset enable industry transformation through semiconductor technology and contributions to people's lives worldwide.