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About the Role
Leading a team developing power management ICs for high power density applications, this role combines people leadership with strong ownership of layout execution, while also adopting and driving new tools and flows across the team. Opportunities include working with advanced power packages and pushing the boundaries of thermal and electrical performance in cutting-edge power solutions.
Responsibilities
- Leading a team developing power management ICs for high power density applications
- Adopting and driving new tools and flows across the team
- Working with advanced power packages
- Pushing the boundaries of thermal and electrical performance in cutting-edge power solutions
- Managing schedules, resource allocation, and cross-functional coordination across design, product, process, reliability, and packaging teams
- Interfacing effectively with circuit designers, product engineers, and foundry partners
- Mentoring and developing junior layout engineers
- Collaborating effectively across functions
- Quickly ramping on new systems and processes
- Taking initiative and driving results with strong time management and on-time delivery
Requirements
- Deep understanding of analog and power layout techniques, including matching, symmetry, current density, electromigration, and IR drop management
- Experience with high-voltage design rules, isolation techniques, and device spacing for BCD/HV processes
- Strong knowledge of parasitic-aware layout for sensitive analog blocks such as bandgaps, references, comparators, and op-amps
- Familiarity with power device layout, including LDMOS, power MOSFETs, bond pads, and ESD structures
- Proficiency with layout tools such as Cadence Virtuoso and verification flows including DRC, LVS, PEX, and parasitic extraction
- Knowledge of packaging considerations, including bond wire, flip-chip, and bump layout, as they relate to PMIC layout
- Ability to manage schedules, resource allocation, and cross-functional coordination across design, product, process, reliability, and packaging teams
- Strong verbal and written communication skills for interfacing effectively with circuit designers, product engineers, and foundry partners
- Experience mentoring and developing junior layout engineers
- Demonstrated interpersonal, analytical, and problem-solving skills, with the ability to collaborate effectively across functions
- Ability to quickly ramp on new systems and processes, take initiative, and drive results with strong time management and on-time delivery
Skills
- Analog and power layout techniques
- Matching
- Symmetry
- Current density
- Electromigration
- IR drop management
- High-voltage design rules
- Isolation techniques
- Device spacing for BCD/HV processes
- Parasitic-aware layout
- Power device layout
- LDMOS
- Power MOSFETs
- Bond pads
- ESD structures
- Cadence Virtuoso
- DRC
- LVS
- PEX
- Parasitic extraction
- Packaging considerations
- Bond wire layout
- Flip-chip layout
- Bump layout
- Schedule management
- Resource allocation
- Cross-functional coordination
- Verbal communication
- Written communication
- Mentoring
- Interpersonal skills
- Analytical skills
- Problem-solving skills
- Collaboration
- System ramp-up
- Process adoption
- Time management
- On-time delivery
Benefits
- Competitive pay
- Benefits designed to help you and your family live your best life
About the Company
- Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment.
- At our core, we have a passion to create a better world by making electronics more affordable through semiconductors.
- This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere.
Equal Opportunity
- Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
- All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.
- TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin.
- However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.