Technical Project Manager-Mechanical Systems, Thermal Solutions & Manufacturing at Foxconn Industrial Internet | CA, US | Rezi

Technical Project Manager-Mechanical Systems, Thermal Solutions & Manufacturing at Foxconn Industrial Internet

Technical Project Manager-Mechanical Systems, Thermal Solutions & Manufacturing

Foxconn Industrial Internet · CA, US

Today

Technical Project Manager-Mechanical Systems, Thermal Solutions & Manufacturing

Foxconn Industrial Internet · CA, US

7 hours ago
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About the Role

We are seeking a highly motivated Technical Project Manager to lead the development and industrialization of advanced mechanical and thermal hardware solutions for AI servers, data center infrastructure, HPC, and next-generation computing platforms. This role serves as the primary interface between engineering, manufacturing, suppliers, and customers to drive programs from concept through NPI, qualification, and mass production.

Responsibilities

  • Lead cross-functional hardware development programs from concept, NPI, validation, qualification, and mass production.
  • Manage project schedules, milestones, risks, dependencies, and deliverables while aligning engineering, manufacturing, quality, sourcing, suppliers, and customers.
  • Drive development and industrialization of mechanical and thermal components via processes such as machining, molding, stamping, forging, casting, and liquid cooling assemblies.
  • Support thermal system integration involving cold plates, manifolds, pumps, vapor chambers, heat pipes, and related cooling solutions for AI servers and data center applications.
  • Drive DFM/DFA, GD&T, tolerance analysis, DOE, FMEA, reliability validation, and manufacturing optimization activities.
  • Lead prototype builds, manufacturing readiness reviews, production ramp, and sustaining engineering activities.
  • Resolve technical and manufacturing issues through root cause analysis, data analysis, corrective actions, and continuous improvement.
  • Evaluate new materials, manufacturing processes, and technologies to improve product performance, quality, reliability, and cost.
  • Communicate program status, technical risks, and engineering decisions through technical reviews and customer presentations.

Requirements

  • BS or MS degree in Mechanical Engineering, Thermal Engineering, Materials Science, Manufacturing Engineering, or related technical field.
  • 5+ years of experience in technical project management, NPI, mechanical product development, thermal engineering, or manufacturing engineering.
  • Fluent in Mandarin and English.
  • Strong understanding of mechanical design and manufacturing processes such as including machining, molding, stamping, forging, casting, joining, and assembly.
  • Knowledge of heat transfer, fluid mechanics, thermodynamics, and mechanical system design.
  • Experience with DFM, DFA, GD&T, DOE, FMEA, reliability engineering, and root cause analysis.
  • Familiarity with CAD tools such as Siemens NX, Creo, SolidWorks, or equivalent.
  • Experience with data analysis tools such as JMP, Minitab, or equivalent.
  • Strong project management, analytical, communication, and cross-functional leadership skills.
  • Willingness to travel internationally up to 40%.
  • Experience supporting mechanical components and systems from AI servers, GPU systems, HPC, networking, or consumer electronics products.
  • Experience with liquid cooling systems, cold plates, vapor chambers, CDU interfaces, manifolds, pumps, or thermal module integration.
  • Familiarity with CFD/FEA simulation tools such as ANSYS Icepak, Fluent, Star-CCM+, FloTHERM, or equivalent.
  • Experience on advanced manufacturing, including precision machining, brazing, diffusion bonding, welding, or additive manufacturing.
  • Experience with JDM/ODM co-development programs and global customer engagement.
  • Experience with failure analysis methods such as SEM, EDX, FTIR, or equivalent analytical techniques.

Skills

  • Mechanical Systems
  • Thermal Solutions
  • Manufacturing Processes
  • AI Servers
  • Data Center Infrastructure
  • HPC
  • Next-generation Computing Platforms
  • NPI
  • Machining
  • Molding
  • Stamping
  • Forging
  • Casting
  • Liquid Cooling Assemblies
  • Cold Plates
  • Manifolds
  • Pumps
  • Vapor Chambers
  • Heat Pipes
  • DFM/DFA
  • GD&T
  • Tolerance Analysis
  • DOE
  • FMEA
  • Reliability Validation
  • Root Cause Analysis
  • CAD (Siemens NX, Creo, SolidWorks)
  • Data Analysis (JMP, Minitab)
  • Project Management
  • Communication
  • Cross-functional Leadership
  • Mandarin
  • English
  • Heat Transfer
  • Fluid Mechanics
  • Thermodynamics
  • CFD/FEA Simulation
  • Advanced Manufacturing
  • Precision Machining
  • Brazing
  • Diffusion Bonding
  • Welding
  • Additive Manufacturing
  • JDM/ODM Co-development
  • Failure Analysis (SEM, EDX, FTIR)

Location

  • Cupertino, CA
  • San Francisco, CA

Work Type

  • Full-time

Experience Level

  • 5+ years of experience

Education Level

  • BS or MS degree in Mechanical Engineering, Thermal Engineering, Materials Science, Manufacturing Engineering, or related technical field.

Salary/Compensations

  • $130,000-$160,000