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About the Role
Annapurna Labs designs silicon and software that accelerates innovation. We are seeking a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next-generation machine learning and data center ASICs. In this role, you will develop automation to enable physical design teams to execute Package and PCB products from floor planning through tape out and manufacturing release.
Responsibilities
- Develop and deploy efficient design methodologies to support Package and PCB layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Evaluate industry EDA offerings and make recommendations for purchase and usage of advanced packaging features to design 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies.
- Deliver custom design automation to improve RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Contribute to cross-level teams for co-optimization across die RDL, interposer/substrate, and PCB levels.
- Develop data integration flows for co-design data across Package, PCB and SI/PI flows.
- Develop software in Python, Skill, TCL. Utilize AI coding agents to speed development and iteration.
- Identify preferred methodologies to integrate physical verification checks (DRC, connectivity, shorts/opens) into physical design cycles.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout methodologies — impedance-controlled routing, power plane optimization, and critical net shielding.
Requirements
- Bachelor's degree in Computer Science, Computer Engineering, or Electrical Engineering
- 7+ years of experience working with physical design tools across Package and PCB domains: Allegro, APD, 3DICC, Expedition
- 10+ years of Automation experience for physical designs
Skills
- Python
- Skill
- TCL
- Physical design tools
- Package and PCB domains
- Allegro
- APD
- 3DICC
- Expedition
- Automation for physical designs
- 2.5D interposer design
- 3D-IC design
- Fan-out wafer-level packaging
- Silicon bridge technologies
- Microbumps
- C4 bumps
- TSVs
- Microvias
- PTH vias
- Multi-layer organic substrates
- Silicon interposers
- Physical verification checks
- DFM compliance
- Impedance-controlled routing
- Power plane optimization
- Critical net shielding
Location
- USA, TX, Austin
Work Type
- Onsite
Experience Level
- Senior
- 7+ years
- 10+ years
Education Level
- Bachelor's degree in Computer Science, Computer Engineering, or Electrical Engineering
- Master's degree or Ph.D. degree in Electrical Engineering or related field
Salary/Compensations
- 185,200.00 - 250,000.00 USD annually
Benefits
- Sign-on payments
- Restricted stock units (RSUs)
- Health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage)
- 401(k) matching
- Paid time off
- Parental leave
About the Company
- Annapurna Labs designs silicon and software that accelerates innovation.
- Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday.
- Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
Equal Opportunity
- Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
- Our inclusive culture empowers Amazonians to deliver the best results for our customers.
- If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.