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About the Role
This position involves defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions.
Responsibilities
- Define and lead the development of advanced packaging and 3DIC analysis flows.
- Analyze the customer's environment and evaluate appropriate solutions.
- Be knowledgeable and aware of competitive technologies.
- Anticipate technical issues and develop creative solutions.
- Take technical lead on a wide range of projects.
- Understand high-speed, high-performance signal and power integrity-related issues.
- Work with peers and other business groups.
- Communicate effectively with Cadence R&D, Product Engineering, Marketing and customers.
- Understand customer success criteria and ensure customer success.
Requirements
- Expert knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power design, signal integrity, power integrity and definition of electrical constraints.
- Design experience and industry knowledge of one of Signal, Power, and Thermal analysis associated with IC, package, or PCB design is required.
- Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering.
- Minimum 15 years experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design.
- 5+ years experience with Cadence SI/PI tools Allegro platform tools including: Sigrity, Clarity, PCB Editor, ICP preferred.
- Strong knowledge of advanced packaging concepts.
- Strong knowledge of 2.5D, 3DIC and stacked die technologies.
- Understanding of chip level CMOS design concepts desired.
- Strong customer-facing communication and problem-solving skills.
- Strong personal drive for continuous learning and expanding professional skill sets.
- Excellent verbal and written communication skills.
Skills
- Signal Integrity
- Power Integrity
- Electromagnetics
- Thermal Analysis
- RF Analysis
- Package Design
- PCB Design
- Cadence SI/PI tools
- Allegro platform tools
- Sigrity
- Clarity
- PCB Editor
- ICP
- Advanced packaging concepts
- 2.5D technologies
- 3DIC technologies
- Stacked die technologies
- Chip level CMOS design concepts
- Customer-facing communication
- Problem-solving
- Continuous learning
- Verbal communication
- Written communication
Location
- US
Work Type
- Remote
- Full-time
Experience Level
- Minimum 15 years experience
- 5+ years experience
Education Level
- Bachelor’s degree
- Masters degree
Salary/Compensations
- $88,200 to $163,800
Benefits
- Incentive compensation: bonus, equity
- Competitive On Target Earnings (OTE) incentive compensation structure
- Paid vacation
- Paid holidays
- 401(k) plan with employer match
- Employee stock purchase plan
- Variety of medical, dental and vision plan options
About the Company
- At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
- We’re doing work that matters. Help us solve what others can’t.