Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027 at Qualcomm | AZ, US | Rezi

Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027 at Qualcomm

Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

Qualcomm · AZ, US

6 days ago

Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

Qualcomm · AZ, US

6 days ago
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About the Role

As a Qualcomm Hardware Engineering Intern, you’ll have the opportunity to push the boundaries of what exists and help establish the new standards for tomorrow. You will leverage your electrical and/or computer engineering degree to work on one of Qualcomm's multi-disciplinary teams, supporting technical tracks including GPU Engineering, CPU Engineering, Digital Design/DV, and SoC Systems Engineering.

Responsibilities

  • Leverage electrical and/or computer engineering degree to work on multi-disciplinary teams.
  • Support technical tracks including GPU Engineering, CPU Engineering, Digital Design/DV, and SoC Systems Engineering.
  • Engineering design and development in MSM SOC and chipset architecture (GPU Engineering).
  • ASIC implementation of image processing camera IP (GPU Engineering).
  • GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models) (GPU Engineering).
  • Graphics power analysis & optimization (Vulkan) (GPU Engineering).
  • Validation of CPU and SOC-level micro-architecture concepts (CPU Engineering).
  • Development of test and coverage plans, verification methodology, and scalable environments (CPU Engineering).
  • Execution of verification plans including regression, debug, and bring-up (CPU Engineering).
  • RTL development for modem physical and MAC layer processing (Digital Design / DV).
  • Verification component development using SystemVerilog and UVM (Digital Design / DV).
  • Modeling cellular modem datapaths for bit-exact correctness (Digital Design / DV).
  • Concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.) (SoC Systems Engineering).
  • System-level performance modeling and simulation (SoC Systems Engineering).
  • Power and thermal management strategies (SoC Systems Engineering).
  • Post-silicon validation and characterization (SoC Systems Engineering).
  • Embedded software design, driver development for Linux/Windows (SoC Systems Engineering).
  • OS principles and HW/SW interaction (SoC Systems Engineering).
  • Experience supporting or optimizing machine learning workloads on embedded systems or accelerators (SoC Systems Engineering).
  • Understanding of power/performance tradeoffs and system-level architecture (SoC Systems Engineering).

Requirements

  • Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field.
  • Must be available for 11–14 weeks during Summer 2027 (May–September).
  • Expected graduation date of November 2027 or later.
  • 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog.
  • Candidates actively pursuing a degree with an anticipated graduation between November 2027 and June 2028 (Preferred).
  • Currently enrolled in a Master’s or PhD degree program in computer engineering, electrical engineering, or a related field (Preferred).
  • Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G (GPU Engineering).
  • Familiarity with simulators, coverage tools, waveform viewers (CPU Engineering).
  • Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi (Digital Design / DV).
  • Exposure to machine learning concepts as applied to digital signal processing or modem architecture is a plus (Digital Design / DV).
  • Programming experience in C/C++, Python; scripting and profiling tools (SoC Systems Engineering).

Skills

  • C
  • C++
  • Python
  • Perl
  • Verilog
  • SystemVerilog
  • GPU Engineering
  • CPU Engineering
  • Digital Design / DV
  • SoC Systems Engineering
  • MSM SOC
  • Chipset architecture
  • Image processing camera IP
  • GPU pipeline validation
  • Graphics power analysis
  • Vulkan
  • CPU validation
  • SOC-level micro-architecture
  • Test and coverage plans
  • Verification methodology
  • Scalable environments
  • Regression
  • Debug
  • Bring-up
  • Simulators
  • Coverage tools
  • Waveform viewers
  • RTL development
  • Modem physical layer processing
  • Modem MAC layer processing
  • Verification component development
  • UVM
  • Cellular modem datapaths
  • Digital design
  • DSP
  • Wireless communication
  • LTE
  • 5G
  • Wi-Fi
  • Machine learning concepts
  • Computer architecture
  • System-level performance modeling
  • System-level simulation
  • Power management strategies
  • Thermal management strategies
  • Post-silicon validation
  • Characterization
  • Embedded software design
  • Driver development
  • Linux
  • Windows
  • OS principles
  • HW/SW interaction
  • Machine learning workloads
  • Embedded systems
  • Accelerators
  • Power/performance tradeoffs
  • System-level architecture
  • Scripting tools
  • Profiling tools
  • Audio/video codecs
  • Camera
  • WLAN
  • Matlab

Location

  • Austin
  • Boulder
  • Boxborough
  • Bridgewater
  • Chandler
  • Irvine
  • New York City
  • Louisville
  • Raleigh
  • San Diego
  • Santa Clara
  • Seattle

Work Type

  • Internship

Experience Level

  • Intern
  • 1+ years of academic experience

Education Level

  • Bachelor’s degree program
  • Master’s degree program
  • Ph.D. degree program

Salary/Compensations

  • $17.00 - $98.00

Benefits

  • Competitive hourly pay
  • Accrued vacation time
  • Relocation coverage
  • Furnished housing accommodations
  • Professional development workshops
  • Social events
  • Cross-functional speaker sessions
  • Executive speaker series
  • Competitive annual discretionary bonus program
  • Opportunity for annual RSU grants
  • Highly competitive benefits package

About the Company

  • Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies.
  • Our solutions are pivotal in crafting a smarter, interconnected world.
  • Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity.
  • We’re proud to be the partner of choice to many of the world’s largest enterprises.
  • Together with our ecosystem partners, we enable next-generation digital transformation.
  • At Qualcomm, we are engineering human progress.
  • We're committed to engineering human progress by delivering intelligent computing everywhere.
  • We're passionate about harnessing the power of technology to transform industries and improve lives.
  • Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work.
  • By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity.
  • With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology.
  • Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline.
  • You'll be part of a community that values collaboration, creativity, and continuous learning.
  • Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals.
  • Join us for our U.S. 2027 summer intern class!

Equal Opportunity

  • Qualcomm is an equal opportunity employer.
  • If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process.
  • Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process.
  • Qualcomm is also committed to making our workplace accessible for individuals with disabilities.
  • Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.