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About the Role
As a Qualcomm Mechanical Engineering Intern, you will push the boundaries of existing technology and help establish new standards. You will work as an equal contributor on a team of leading engineers to design, simulate, and test mechanical and thermal systems supporting Qualcomm’s advanced semiconductor technologies. Projects may span IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling solutions.
Responsibilities
- Design, simulate, and test mechanical and thermal systems
- Contribute to projects spanning IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling solutions
Requirements
- Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in mechanical engineering, materials science, or a related field
- Must be available for 11–14 weeks during Summer 2027 (May–September)
- Expected graduation date of November 2027 or later
- 1+ years of academic experience with programming languages such as Python, Matlab
- Candidates actively pursuing a degree with an anticipated graduation between November 2027 and June 2028
- Familiarity with Cadence Sip, AutoCAD, and Solidworks
- Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA)
- Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes
- Experience with thermal system design, modeling, and testing
- Understanding of heat transfer, mechanical design, and microelectronics
- Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology
- Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation
Skills
- Python
- Matlab
- Cadence Sip
- AutoCAD
- Solidworks
- Solid Mechanics
- Mechanics of Materials
- Finite Element Analysis (FEA)
- IC packaging structures
- Chip-package interaction
- Electronic packaging processes
- Thermal system design
- Thermal system modeling
- Thermal system testing
- Heat transfer
- Mechanical design
- Microelectronics
- Server product design
- System impedance testing
- Fan performance measurement
- Heatsink design methodology
- Computational Fluid Dynamics (CFD)
- Wind tunnel operation
- Airflow bench operation
Location
- Austin
- Boulder
- Boxborough
- Bridgewater
- Chandler
- Irvine
- New York City
- Louisville
- Raleigh
- San Diego
- Santa Clara
- Seattle
Work Type
- Internship
Experience Level
- Intern
Education Level
- Bachelor's degree
- Master's degree
- Ph.D. degree
Salary/Compensations
- $17.00 - $98.00
Benefits
- Competitive hourly pay
- Accrued vacation time
- Relocation coverage
- Furnished housing accommodations
- Professional development workshops
- Social events
- Cross-functional speaker sessions
- Executive speaker series
About the Company
- Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies.
- Our solutions are pivotal in crafting a smarter, interconnected world.
- Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity.
- We’re proud to be the partner of choice to many of the world’s largest enterprises.
- Together with our ecosystem partners, we enable next-generation digital transformation.
- At Qualcomm, we are engineering human progress.
- We're committed to engineering human progress by delivering intelligent computing everywhere.
- We're passionate about harnessing the power of technology to transform industries and improve lives.
- Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work.
- By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity.
- With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology.
- Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline.
- You'll be part of a community that values collaboration, creativity, and continuous learning.
- Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals.
- Join us for our U.S. 2027 summer intern class!
Equal Opportunity
- Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.