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About the Role
We are seeking an experienced PCB Designer to lead high-complexity RF and phased array board layouts. You will translate schematics and floorplans into manufacturable, high-performance multilayer designs for satellite, HAPS/NTN, and defense applications.
Responsibilities
- Design and lay out complex multilayer PCBs for RF and mixed-signal systems using Mentor (Siemens) Xpedition
- Execute phased array panel layouts, including tightly matched feed networks, controlled-impedance routing, and lattice-spacing constraints for antenna elements
- Manage length/phase matching, impedance control, and signal integrity for high-frequency and high-speed signals
- Develop and maintain constraint sets, layer stackups, and design rules in coordination with fabrication and assembly partners
- Perform DFM/DFA/DFT reviews and work with vendors to resolve manufacturability issues
- Generate complete fabrication and assembly documentation (Gerber/ODB++, drill, fab drawings, assembly drawings, BOM)
- Collaborate with antenna, RF, thermal, and mechanical engineers on board partitioning, grounding, shielding, and thermal management
Requirements
- BSc in Electrical Engineering or a related field
- 5+ years of PCB layout experience, with demonstrated expertise in Mentor Xpedition (Enterprise/Designer flow)
- Proven experience with RF/microwave PCB design, including controlled impedance, transmission-line structures, and RF component placement
- Strong understanding of signal integrity, power integrity, and high-frequency layout techniques
- Experience with multilayer, high-density (HDI) boards and advanced stackups
- Proficiency generating industry-standard fabrication/assembly outputs and interfacing with fab houses
- Working knowledge of IPC standards (IPC-2221, IPC-7351, IPC-A-600/610)
- Applicants must be U.S. persons (U.S. citizens, lawful permanent residents, or protected individuals under 8 U.S.C. § 1324b(a)(3)), or otherwise eligible under applicable export authorizations.
Skills
- PCB Design
- RF PCB Design
- Phased Array Layout
- Mentor Xpedition
- Signal Integrity
- Power Integrity
- High-Frequency Layout
- Multilayer PCB Design
- HDI Boards
- IPC Standards
Experience Level
- 5+ years of PCB layout experience
Education Level
- BSc in Electrical Engineering or a related field