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About the Role
As part of AMD's Advanced Packaging team, you will drive technology development of advanced 3D package architectures. The scope includes executing and coordinating proof of concept on new technology, product bring up, and continuous yield and reliability improvement to meet performance, cost, and schedule requirements for new AMD products.
Responsibilities
- Drive/participate in defining FMEA, TV Design, DFM, and DFY.
- Manage DOE plan and execution for material selections and process window validation.
- Define quality and reliability tests including defect detection and FA methodology.
- Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions that meet product requirements.
- Transfer new products into a high yielding, cost-effective, high-volume manufacturing environment.
- Enable development partners in the AMD Ecosystem to bring up new packaging technology/process from concept to NPI and prototyping to mass production.
- Lead and perform process optimization, yield, and reliability improvement.
Requirements
- Proven track record and extensive knowledge and experience in wafer process Integration, such as BEOL Integration, 3D integration with TSV, and Hybrid Bonding (CoW and W2W).
- Hands-on approach to process bring up and development.
- Excellent oral and written communication skills to communicate ideas with Foundry Partners, Suppliers, Internal Stakeholders and AMD Management.
- Fundamental knowledge and experience with BEOL process, TSV integration, and Hybrid bonding process and defect metrology.
- Strong knowledge and experience in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR.
- Strong knowledge with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques.
- Experience in the industry with strong problem solving, communication, organizational, interpersonal, and presentation skills.
- This role is not eligible for visa sponsorship.
Skills
- BEOL Integration
- 3D integration with TSV
- Hybrid Bonding (CoW and W2W)
- FMEA
- TV Design
- DFM
- DFY
- DOE
- Defect detection
- FA methodology
- Process optimization
- Yield improvement
- Reliability improvement
- BEOL process
- TSV integration
- Hybrid bonding process
- Defect metrology
- Design and reliability
- CPI
- Thermo-mechanical analysis
- DFR
- Advanced Packaging Techniques
- Fan-out packaging
- 3D stacking
- 2.5D packaging
- MCM packaging
- Problem solving
- Communication
- Organizational skills
- Interpersonal skills
- Presentation skills
Location
- Hybrid
Work Type
- Hybrid
Experience Level
- Extensive knowledge and experience
- Experience in the industry
Education Level
- Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.
Benefits
- AMD benefits at a glance.
About the Company
- At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
- Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward.
Equal Opportunity
- AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.
- We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
- AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.