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About the Role

Lead a global technical program management organization responsible for driving the execution of strategic AI/Datacenter Infrastructure Power package engineering and new product introduction (NPI) programs. Partner closely with cross-functional teams and external partners to ensure programs meet schedule, quality, and production readiness requirements. Establish strong program governance, identify and escalate risks, and lead task forces to resolve development challenges.

Responsibilities

Lead the global Technical Program Management (TPM) organization supporting AI/Datacenter Infrastructure Power NPI and package engineering programs.
Partner with Package Engineering Directors, providing program-level execution leadership, governance, and accountability.
Establish and drive end-to-end NPI program plans, milestones, critical paths, resource alignment, risk management, and executive reporting.
Create a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing.
Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks; establish mitigation plans and escalate critical issues.
Lead cross-functional technical task forces for major development challenges.
Drive structured problem solving and closure of critical issues using data-driven methods, root-cause analysis, and risk assessment.
Coordinate closely with Package Engineering, Power product group partners, Product Engineering, Reliability, Quality, Operations, Supply Chain, and other functional leaders to remove execution barriers.
Establish program dashboards and management systems for transparent visibility to milestones, risks, issues, and recovery plans.
Lead technical program management activities with key OSAT/CM partners, including program reviews, milestone tracking, issue escalation, and recovery plans.
Ensure execution of Engineering Build Requests (EBRs) per committed schedule at each OSAT, tracking progress and driving recovery actions.
Develop and lead TPM teams located at strategic OSATs, ensuring alignment with Renesas priorities and schedules.
Ensure OSAT/CM development activities, DOE, process optimization, qualification, and production readiness align with NPI program objectives.
Drive timely resolution of process integration and assembly issues impacting product quality, reliability, yield, or customer commitments.
Ensure effective transition from development and qualification into production, including readiness reviews and ramp monitoring.
Establish standardized program management processes, templates, metrics, escalation mechanisms, and lessons-learned practices.
Provide concise, fact-based executive communication on program health, risks, schedule recovery, and resource needs.
Build strong relationships with OSAT/CM executive and technical leadership to improve responsiveness and execution.
Develop the technical and leadership capabilities of the TPM organization and establish a high-performance culture.
Support package technology roadmap execution by translating strategic priorities into executable development programs.
Address internal and external customer-impacting issues in partnership with Marketing, Product, Quality, Operations, and Package Engineering.

Requirements

Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline.
15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field.
Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
Strong understanding of semiconductor product development process, package and assembly processes.
Experience in Power Management products, particularly power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management system, PMICs, wafer-level and/or flip-chip technologies.
Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.
Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule.
Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.
Exceptional program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.
Strong interpersonal, communication, negotiation, and executive presentation skills.
Ability to influence senior technical and business leaders without direct authority and drive accountability across organizational boundaries.
Experience building and leading global teams, including teams in product groups, embedded at external manufacturing or OSAT locations.
Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions.
Experience supporting high-growth customer programs.
Experience with Smart Power Stage, Vertical Power Stage, power module, discrete FET, SiC/GaN, DBC/AMB, multi-chip, wafer-level, or advanced interconnect technologies.
Experience with formal technical program management methodologies and portfolio-level governance.
Experience driving customer-critical NPI programs in a fast-paced, high-growth environment.

Skills

AI/Datacenter Infrastructure Power package engineering
New Product Introduction (NPI)
Technical Program Management
Semiconductor product development
Package and assembly processes
Power Management products
SiP/modules
Smart Power Stages
Vertical Power Stages
Power Modules
Discrete FET packages
Battery management system
PMICs
Wafer-level technologies
Flip-chip technologies
OSAT/CM management
Cross-functional task force leadership
Quality management
Reliability engineering
Yield optimization
Manufacturability improvement
Schedule management
Statistical Process Control (SPC)
Risk management
Structured problem-solving
Interpersonal communication
Negotiation
Executive presentation
Influencing skills
Analytical skills
SiC/GaN
DBC/AMB
Multi-chip technologies
Advanced interconnect technologies
Formal technical program management methodologies
Portfolio-level governance

Location

Global

Work Type

Regular (PERM)

Experience Level

15-20+ years

Education Level

Doctorate
Master’s
Bachelor’s Degree

Benefits

Competitive benefits package

About the Company

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier.
With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together.
This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

Equal Opportunity

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law.
For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.