Design Engineer, Microelectronics Packaging at IQM Quantum Computers | JP | Rezi

Design Engineer, Microelectronics Packaging at IQM Quantum Computers

Design Engineer, Microelectronics Packaging

IQM Quantum Computers · JP

1 weeks ago

Design Engineer, Microelectronics Packaging

IQM Quantum Computers · JP

9 days ago
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About the Role

Develop the 3D integrated stack for quantum processing units (QPUs) that provides clean, high-quality microwave and DC connectivity, designed to perform at cryogenic temperatures. This role is part of the Emerging Technologies team, based in Japan, and will define packaging solutions for future generations of QPUs.

Responsibilities

  • Develop functionalities and features of the 3D integrated stack for high-quality microwave and DC connectivity under cryogenic operation.
  • Define stack and process requirements with internal teams and external fabrication partners, covering PCB, ceramic, glass, or silicon-based processes.
  • Develop, optimize, and characterize die packaging processes for chips operating in cryogenic environments.
  • Plan and implement testing and validation procedures with IQM and Japanese partners.
  • Act as the technical link between IQM and partners, balancing QPU package requirements with achievable outcomes.
  • Contribute to planning test strategies, identifying available capabilities at IQM and partner sites.
  • Perform electrical and thermal characterization of stack features.
  • Document work clearly for easy understanding across time zones.
  • Work independently while staying connected to IQM's European development teams.

Requirements

  • Master's or PhD in experimental physics, electrical engineering, or a related technical field.
  • Experience with heterogeneous 3D integration technologies, such as bump bonding or RDL fan-out.
  • Working knowledge of standard CAD tools used in package design.
  • Understanding of DC, thermal, and/or microwave characterization techniques.
  • Familiarity with cryogenic measurement techniques.
  • Comfortable working independently and coordinating across IQM's European teams and external partners.
  • Strong documentation skills.
  • Fluent spoken and written English and Japanese.
  • Willingness to travel.

Skills

  • 3D integration technologies
  • Bump bonding
  • RDL fan-out
  • CAD tools
  • DC characterization
  • Thermal characterization
  • Microwave characterization
  • Cryogenic measurement techniques
  • Documentation
  • English
  • Japanese

Location

  • Japan

Work Type

  • Hybrid
  • Full-time

Experience Level

  • Mid-level
  • Senior

Education Level

  • Master's degree
  • PhD

Benefits

  • Hybrid setups
  • Flexible hours
  • Learning Hub
  • LinkedIn Learning
  • Team-based L&D budget

About the Company

  • IQM builds world-leading quantum computers for the well-being of humankind, designing systems to tackle computational challenges beyond classical machines.
  • The company operates at the edge of science and engineering, turning deep research into reliable, full-stack systems.
  • IQM offers full-stack quantum computing, from hardware to software layers.
  • The company fosters a high-performance environment with a focus on work-life balance.
  • IQM has an approachable leadership with a flat hierarchy.
  • The company is described as the sweet spot between a startup and a corporation, allowing top performers to get noticed.
  • IQM contributes to the quantum ecosystem by publishing papers, running hackathons, and shaping the market.
  • Funding: 600M€+
  • Team Members: 400+
  • Quantum Computers Built: 30+
  • Patents Filed: 300+
  • Locations Globally: 10