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About the Role

Contribute to and own aspects of the Volantis A-0 and A-1 package, focusing on package design or process development for wafer-scale packages with silicon and compound semiconductor dies. Address challenges in warpage, CTE mismatch, thermomechanical aspects, and assembly speed to enable a new era of AI by breaking the memory wall.

Responsibilities

Contribute to and own aspects of the Volantis A-0 and A-1 package.
Design or process development of complex packages.
Work with architects to co-design system architecture and package design.

Requirements

Ability to think from first principles about novel problems.
Understanding that solutions for 5x reticle platforms may not work for 56x reticle platforms.

Skills

Package design
Package process development
Heterogeneous material assemblies
High-TDP packages
Compound semiconductor assemblies
Co-packaged optics
Interposer platforms (CoWoS, CoWoS-L, CoWoS-R, EMIB, FoCoS, FoCoS-Bridge, etc.)
Flip-chip integration (mass reflow, TCB & LAB)
Large scale substrates (>50x50mm)

Salary/Compensations

$250K-$400K

Benefits

Competitive Base salary
Significant Equity Stake

About the Company

Building a wafer-scale package with both silicon and compound semiconductor dies sitting together at very high TDP.
The end result is breaking the memory wall, enabling a new era of AI, and a platform that scales another 1-3 orders of magnitude.