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About the Role

We are seeking a Senior Micro-Optics/Microlens Array Engineer to design, model, and validate microlens-array and wafer-level micro-optical components for high-density photonic packages. You will translate system-level optical requirements into manufacturable designs, build tolerance budgets, work with fabrication and packaging partners, and close the loop with measured data.

Responsibilities

Own micro-optical design, including lens pitch, aperture, focal length, numerical aperture, sag, surface form, fill factor, array uniformity, substrate, material, and coating choices.
Build connected optical models using tools such as Zemax OpticStudio, Code V, FRED, LightTools, VirtualLab, Ansys/Lumerical, COMSOL, or equivalent.
Bridge EM-scale and package-scale design by connecting electromagnetic simulations to system-level optical models.
Develop sensitivity studies and tolerance budgets across fabrication, placement, package stack-up, and environmental variations.
Partner with process and supplier teams across lithography, patterning, etch transfer, deposition, thin-film coatings, and metrology.
Create vendor-ready specifications, optical prescriptions, mechanical drawings, material and coating requirements, and metrology plans.
Evaluate fabrication routes such as photoresist reflow, grayscale lithography, etch transfer, molding, and replication.
Plan and run prototype characterization, including surface profile, focal length, and optical throughput.
Build Python tools for simulation sweeps, tolerance studies, data reduction, visualization, and reporting.
Partner with packaging, mechanical, thermal, test, reliability, device, and system teams to move designs from concept to qualified hardware.

Requirements

M.S. or Ph.D. in Optical Engineering, Electrical Engineering, Applied Physics, Physics, Photonics, Mechanical Engineering, Materials Science, or a related field; B.S. with exceptional relevant experience also considered.
Industry experience in micro-optics, wafer-level optics, optical design, photonic packaging, optomechanics, precision optics, semiconductor process integration, or advanced optoelectronic hardware.
Experience designing microlens arrays, aspheric micro-optics, diffractive or hybrid micro-optical surfaces, compact optical elements, or package-level optical features with manufacturing constraints.
Proficiency with optical modeling and tolerancing in Zemax OpticStudio, Code V, FRED, LightTools, VirtualLab, Ansys/Lumerical, COMSOL, or equivalent.
Ability to convert requirements into an optical design, tolerance budget, supplier data package, and practical characterization plan.
Experience with prototype characterization, failure analysis, design iteration, and model-to-hardware correlation.
Python skills for simulation automation, numerical analysis, data reduction, and reporting.
Clear written and verbal communication.
Ability to operate independently in a fast-changing startup environment.

Skills

Micro-optics
Microlens array design
Optical design
Optical modeling
Zemax OpticStudio
Code V
FRED
LightTools
VirtualLab
Ansys/Lumerical
COMSOL
FDTD
FEM
EME
RCWA
Tolerancing
Yield analysis
Monte Carlo methods
DOE methods
Semiconductor process awareness
Lithography
Grayscale patterning
Imprint
Etch transfer
Deposition
Thin-film coatings
Wafer-level metrology
Design rules
Process-window trade-offs
Vendor specifications
Optical prescriptions
Mechanical drawings
Metrology plans
Incoming inspection criteria
Acceptance criteria
Fabrication routes
Photoresist reflow
Molding
Replication
Prototype characterization
Surface profile
Focal length
Array uniformity
Optical throughput
Reflection behavior
Polarization sensitivity
Thermal drift
Environmental stability
Alignment sensitivity
Python
Simulation automation
Data reduction
Visualization
Dashboards
Technical reporting
Cross-functional collaboration
Packaging
Mechanical engineering
Thermal engineering
Test engineering
Reliability engineering
Device engineering
System engineering
Wafer-level optics
Optomechanics
Precision optics
Semiconductor process integration
Advanced optoelectronic hardware
Aspheric micro-optics
Diffractive surfaces
Hybrid micro-optical surfaces
Compact optical elements
Package-level optical features
Manufacturing constraints
EM-to-system optical modeling
Microfabrication
Process variation
DFM
Failure analysis
Model-to-hardware correlation
Numerical analysis
Written communication
Verbal communication
Independent operation
Startup environment
Concept development
Prototype builds
Supplier qualification
Production ramp
High-density optoelectronic packages
Semiconductor photonics packages
Optical interconnect hardware
Co-packaged optics
Sensing systems
LiDAR
AR/VR optics
Miniature imaging
Datacom hardware
Mask review
Layout review
Critical-dimension data
SEM interpretation
AFM interpretation
Profilometry interpretation
Film-stack review
Process-control limits
Foundry interaction
Process team interaction
DVT
Reliability screening
Thermal cycling
Humidity exposure
High-temperature storage
Environmental qualification
Optomechanical CAD
GD&T
SolidWorks
NX
Creo
Zemax CAD exchange
Lab automation
Motion stages
Cameras
Optical power meters
OSAs
Temperature controllers
SMUs
Oscilloscopes
PyVISA
SCPI
LabVIEW
Owner mindset
Bias for action
Cross-functional fluency
Builder mentality

Experience Level

Senior

Education Level

M.S. or Ph.D. in Optical Engineering, Electrical Engineering, Applied Physics, Physics, Photonics, Mechanical Engineering, Materials Science, or a related field; B.S. with exceptional relevant experience also considered.

About the Company

We do not expect one person to match every item below. Strong candidates from micro-optics, optical packaging, semiconductor photonics, lithography/process integration, precision optics, or FDTD-Zemax co-design backgrounds are encouraged.
This section is a guide, not a rigid checklist. We care most about evidence of technical ownership, sound physics, manufacturability judgment, and the ability to learn quickly.
Owner mindset: drive ambiguous technical problems from first principles to measured hardware.
Bias for action: build lightweight experiments, define clear metrics, and iterate based on data.
Cross-functional fluency: communicate trade-offs across optics, semiconductor process, packaging, mechanical, thermal, test, reliability, and systems teams.
Builder mentality: create reusable models, scripts, specifications, and test methods.