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About the Role
We are seeking photonics packaging engineers to contribute to and own aspects of the A-0 and A-1 packages. This role uniquely bridges photonics and advanced packaging skillsets.
Requirements
- Experience with integrated photonics package assemblies with multiple dies
- Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
- Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Skills
- Photonics
- Advanced Packaging
- Integrated Photonics Package Assemblies
- Integrated Circuit MCM Assemblies
- Compound Semiconductors
- Photonics Concepts
- PIC Design