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About the Role
We are seeking engineers to contribute to the thermomechanical, electrical, and mechanical design and assembly of IO modules for A-0 and A-1 wafers.
Requirements
- Deep understanding and hands-on experience with signal integrity signoff for copper and electro-optic connector interfaces
- Hands-on experience with mechanical aspects of electrical and electro-optic connectors
- Experience with bringup of connectorized links and systems
Skills
- Signal integrity signoff
- Copper connector interfaces
- Electro-optic connector interfaces
- Mechanical aspects of electrical connectors
- Mechanical aspects of electro-optic connectors
- Bringup of connectorized links
- Bringup of connectorized systems