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About the Role
Contribute to and own blocks in the development of A-0 and A-1 wafer products, across XPU, memory chiplet, and other dies on the wafer.
Responsibilities
- Own ASIC design blocks for A-0 and A-1 wafer products.
- Contribute to the development of XPU, memory chiplet, and other dies.
Requirements
- Hands-on experience with multiple advanced node tapeouts.
- Ownership of ASIC design portion of at least one block in multiple advanced node tapeouts.
- Understanding of PPA improvement and available levers.
- Ability to think creatively about methodology for fast design iterations.
- Hands-on experience with ASIC design process for large die (ideally reticle max) chips.
- Hands-on experience with ASIC design process for AI chips.
- Hands-on experience with multi-die/multi-chiplet/MCM designs.
Skills
- ASIC design
- PPA improvement
- Methodology development
- Large die design
- AI chip design
- Multi-die/multi-chiplet/MCM design