Package Design Engineer at Broadcom | SG | Rezi

Package Design Engineer at Broadcom

Package Design Engineer

Broadcom · SG

1 weeks ago

Package Design Engineer

Broadcom · SG

14 days ago
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About the Role

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters. You will join a worldwide R&D team developing high-performance package designs for ASICs used in AI, networking, HPC, and 5G base stations, including SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, and HBM. You will collaborate to create necessary package structures for new designs.

Responsibilities

  • Overall design responsibility for ASIC package designs (layout/routing), including impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with package engineering experts.
  • Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc.
  • Schedule, prioritize, and track work across multiple projects simultaneously.
  • General flip-chip BGA package design & engineering.

Requirements

  • Knowledge of package-level signal integrity and power integrity, to apply to package designs.
  • Cadence APD (allegro package designer) experience is preferred. Equivalent tools will also be considered.
  • Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers.
  • Good organizational and task management skills to manage multiple package design projects.

Skills

  • flip-chip-BGA package design
  • high-speed SerDes
  • signal integrity
  • power integrity

Experience Level

  • 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes (B.Eng)
  • 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes (M.Eng)
  • 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred (B.Eng)
  • 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred (M.Eng)
  • Experience with 2.5D and 3DIC packages is highly advantageous.

Education Level

  • B.Eng (EE/EEE) or similar field
  • M.Eng (EE/EEE) or similar field

About the Company

  • Broadcom is proud to be an equal opportunity employer.

Equal Opportunity

  • We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.
  • We will also consider qualified applicants with arrest and conviction records consistent with local law.