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About the Role

Develop and manage package technology for Renesas's AI/Datacenter Infrastructure Power packaging needs, focusing on new package development, qualification, and technology roadmap definition.

Responsibilities

• Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.
• Design and development of package and interconnect methods for power packaging needs, including Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages.
• Develop WBG (SiC & GaN) along with DBC, AMB substrates and advanced interconnect technologies.
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM to develop, run DOE to optimize processes and establish process specifications.
• Collaborate with Product groups and Reliability team to qualify new packages and processes within required timeframes.
• Resolve process integration issues by ensuring all window checks are done on critical process steps.
• Establish production controls and monitors to ensure quality.
• Ensure smooth transition into production and implement ramp-up monitoring.
• Monitor and resolve process issues during the production phase with OSAT/CM to ensure superior quality parts are shipped to customers.
• Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.
• Participate in packaging roadmap development and focus on execution.
• Address internal and external customer complaints by working with Marketing, Product groups, Quality, and Operations organizations.
• Establish & maintain package design rules.

Requirements

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.
• Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software.
• Knowledge of wire-bonding & multi-chip module technologies is a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Skills

• Power SiP/module
• Wafer level packaging
• Flip-chip packaging
• Assembly process knowledge
• Qualification methods
• SPC
• Statistical analysis software
• Wire-bonding
• Multi-chip module technologies

Location

• Global

Work Type

• Regular

Experience Level

• 15 to 20 years

Education Level

• Doctorate
• Masters
• Bachelor’s Degree

Benefits

• Competitive benefits package

About the Company

• Renesas is one of the top global semiconductor companies in the world.
• We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets.
• Our robust product portfolio includes world leading MCUs, SoCs, Analog and power products, plus Winning Combination solutions that curate these complementary products.
• We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.
• Renesas employs roughly 21,000 people in more than 30 countries worldwide.
• As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial.
• Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values.
• At Renesas, we want to build a sustainable future where technology helps make our lives easier.
• Join us and build your future by being part of what’s next in electronics and the world.
• Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier.
• With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
• At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial.
• It shapes how we work, grow and deliver on our purpose together.
• This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

Equal Opportunity

• Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law.
• For more information, please read our Diversity & Inclusion Statement.