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About the Role

Lead the High-Speed I/F subsystem design and development for automotive SoCs (R-Car series), driving both technical decision-making and organizational leadership. This role is crucial for evolving our development organization by enhancing core domains like the High-Speed I/F subsystem, which is central to automotive electrification and intelligence.

Responsibilities

• Serve as an Engineering Manager responsible for leading the High-Speed I/F subsystem design and development for automotive SoCs (R-Car series).
• Define and drive the specification and architectural direction of the High-Speed I/F subsystem, including PCIe, UCIe, USB and UFS-related areas.
• Ensure quality through design reviews and sound technical judgment.
• Make prioritization decisions and final judgments at the subsystem level, balancing performance, power, quality, schedule, and resource constraints.
• Work closely with SoC architects, other subsystem owners, and project management, promoting overall SoC optimization through cross-functional coordination.
• Take ownership of resolving critical technical and organizational issues that arise during the design and verification phases.
• Oversee technical coordination with third-party IP vendors, including specification alignment, constraint clarification, and issue resolution.
• Manage a global development organization across Japan, India, and Vietnam, driving role definition, team development, and sustainable execution capability.

Requirements

• Experience serving as a technical lead at subsystem or IP level, including responsibility for design reviews, technical decisions, and design direction.
• Proven ability to coordinate multiple engineers and stakeholders and drive development forward.
• Ability to work in English in technical discussions and coordination within a global development environment.
• Japanese language proficiency at a business level.
• Experience in a people-management role, such as Engineering Manager, Section Manager, or equivalent.
• Experience managing multi-member and/or multi-site teams, including offshore development.
• Experience contributing to resource planning, role assignment, and team development.
• Experience participating in mid- to long-term technical roadmap or organizational planning.
• Experience in technical communication with third-party IP vendors or partners (e.g., specification confirmation, constraint alignment, issue resolution).
• Hands-on experience in specification, design, or verification of High-Speed I/F such as PCIe, UCIe, USB, and UFS.
• Experience in automotive SoC development or projects with high quality and/or functional safety requirements.
• Knowledge of power domain separation and physical implementation considerations (e.g., P&R).

Skills

• High-Speed I/F subsystem design and development
• Automotive SoCs (R-Car series)
• PCIe
• UCIe
• USB
• UFS
• Technical decision-making
• Organizational leadership
• Specification definition
• Architectural direction
• Design reviews
• Technical judgment
• Prioritization
• Performance, power, quality, schedule, and resource balancing
• Cross-functional coordination
• Issue resolution
• Technical communication with third-party IP vendors
• Global team management
• Role definition
• Team development
• Sustainable execution capability
• Resource planning
• Role assignment
• Technical roadmap planning
• Organizational planning
• Power domain separation
• Physical implementation considerations (P&R)

Location

• Japan
• India
• Vietnam

Work Type

• Regular
• Onsite

Experience Level

• Technical Lead
• Engineering Manager
• People Management

Benefits

• Competitive compensation
• Comprehensive benefits package

About the Company

• Renesas is a global company providing embedded semiconductor solutions, aiming to 'Make Our Lives Easier'.
• With over 21,000 engineers and problem-solvers in more than 30 countries, we contribute to the development of world-leading technologies in automotive, industrial, infrastructure, and IoT fields.
• We are committed to realizing a safer, healthier, environmentally friendly, and smarter future through semiconductor technology.
• Our corporate culture is centered around 'TAGIE' (Transparent, Agile, Global, Innovative, Entrepreneurial), which guides our work, growth, and pursuit of our Purpose.
• This collaborative spirit and challenging mindset enable us to transform industries and contribute to people's lives worldwide through semiconductor technology.