Physical Design - SOC Top Lead at Efficient Computer | Austin, TX, US | Rezi

Physical Design - SOC Top Lead at Efficient Computer

Physical Design - SOC Top Lead

Efficient Computer · Austin, TX, US

3 weeks ago

Physical Design - SOC Top Lead

Efficient Computer · Austin, TX, US

a month ago
Resume preview

Impress employers and recruiters.
Choose from hundreds of resume examples.

Target Resume Now

About the Role

Efficient is developing the world’s most energy-efficient general-purpose computer processor. Our patented technology uses 100x less energy than state-of-the-art processors and enables perpetual, pervasive intelligence. This role involves end-to-end ownership of SOC -top for next-generation SoCs, driving the full chip from block integration through physical closure to tapeout-ready GDS in state-of-the-art finfet technologies. This is an opportunity to influence products from development to scaled production.

Responsibilities

  • Full-chip integration: floorplanning, power planning, macro/hard-IP placement, and block partitioning at the top level, ensuring convergence across all hierarchical blocks
  • Timing closure: full-chip STA across all corners/modes (setup, hold, OCV, multi-mode multi-corner), including cross-boundary timing and chip-level constraint (SDC) ownership
  • Power: full-chip power planning, PDN design/analysis (IR drop, EM), rail architecture, and coordination on power-gating strategy with block owners
  • Physical verification: DRC/LVS/antenna closure at the top level, seal ring integration, and coordination of ECO cycles across blocks
  • Signal integrity & noise: crosstalk, di/dt, and chip-level noise closure, especially around high-speed IO and PLL/analog boundaries
  • Clock & reset architecture: top-level clock tree strategy across domains, including CTS coordination with block owners
  • DFT integration: chip-level scan stitching, MBIST/JTAG integration, and coordination with DFT lead on ATPG/test coverage closure at full-chip level
  • Package/IO co-design: bump/ball map coordination, IO ring planning, and package-aware floorplanning
  • Tapeout readiness: sign-off checklist ownership (timing, power, physical, reliability) and final GDS handoff
  • Cross-team coordination: single point of contact between block-level PD owners, DV, DFT, package engineering, and architecture on all convergence-related tradeoffs and schedule risk
  • Technical leadership: mentor block-level PD engineers on convergence best practices; set methodology and flow standards for chip-top closure across the program.

Requirements

  • Master's degree in Electrical Engineering with 5+ years of industry experience or PhD in Electrical Engineering with 3+ years of industry experience
  • 8-12+ years of physical design experience, with at least 2-3 full tapeouts at the chip-top/SoC integration level
  • Deep hands-on experience with advanced nodes
  • Proven track record owning full-chip timing closure across multiple corners/modes on a complex SoC
  • Strong PDN/IR-drop/EM analysis experience (Voltus or equivalent)
  • Experience with chip-level DFT integration (scan stitching, MBIST, JTAG)
  • Familiarity with package co-design (flip-chip/BGA, C4 bumps, ball map) is a plus
  • Demonstrated ability to lead technically without direct reports — driving alignment across multiple engineers and teams on convergence decisions
  • Comfortable operating with significant ownership and ambiguity in a small, fast-moving team
  • Experience with non-standard/novel architectures (dataflow, tiled, NoC-based) is a plus but not required
  • Excellent scripting skills in TCL, shell and python.

Skills

  • Innovus (or ICC2)
  • Tempus/PrimeTime
  • RedHawk
  • Calibre
  • TCL
  • shell
  • python
  • computer architecture
  • physical design
  • ASIC implementation
  • full chip sign off convergence
  • circuit design
  • device physics
  • deep sub-micron technology
  • physical design flow
  • analog or mixed-signal macro integration

Experience Level

  • 5+ years of industry experience (Master's)
  • 3+ years of industry experience (PhD)
  • 8-12+ years of physical design experience

Education Level

  • Master's degree in Electrical Engineering
  • PhD in Electrical Engineering

Salary/Compensations

  • $200,000 to $250,000

Benefits

  • Meaningful equity
  • Comprehensive benefits
  • 401K match
  • Company-paid benefits
  • Equity program
  • Paid parental leave
  • Flexibility

About the Company

  • Efficient is developing the world’s most energy-efficient general-purpose computer processor.
  • Efficient’s patented technology uses 100x less energy than state of the art commercially available ultra-low-power processors and is programmable using standard high-level programming languages and AI/ML frameworks.
  • This level of efficiency makes perpetual, pervasive intelligence possible: run AI/ML continuously on a AA battery for 5-10 years.
  • Our platform’s unprecedented level of efficiency enables IoT devices to intelligently capture and curate first-party data to drive the next major computing revolution.
  • This is a unique opportunity to get in at the early stages of a hardware engineering organization and have influence on our products as we move from initial stages of product development to market release and scaled volume production.
  • Join our team and help us shape the future of computing at the edge and beyond!