About the Role
Efficient is developing the world’s most energy-efficient general-purpose computer processor. Our patented technology uses 100x less energy than state-of-the-art processors and enables perpetual, pervasive intelligence. This role involves end-to-end ownership of SOC -top for next-generation SoCs, driving the full chip from block integration through physical closure to tapeout-ready GDS in state-of-the-art finfet technologies. This is an opportunity to influence products from development to scaled production.
Responsibilities
- Full-chip integration: floorplanning, power planning, macro/hard-IP placement, and block partitioning at the top level, ensuring convergence across all hierarchical blocks
- Timing closure: full-chip STA across all corners/modes (setup, hold, OCV, multi-mode multi-corner), including cross-boundary timing and chip-level constraint (SDC) ownership
- Power: full-chip power planning, PDN design/analysis (IR drop, EM), rail architecture, and coordination on power-gating strategy with block owners
- Physical verification: DRC/LVS/antenna closure at the top level, seal ring integration, and coordination of ECO cycles across blocks
- Signal integrity & noise: crosstalk, di/dt, and chip-level noise closure, especially around high-speed IO and PLL/analog boundaries
- Clock & reset architecture: top-level clock tree strategy across domains, including CTS coordination with block owners
- DFT integration: chip-level scan stitching, MBIST/JTAG integration, and coordination with DFT lead on ATPG/test coverage closure at full-chip level
- Package/IO co-design: bump/ball map coordination, IO ring planning, and package-aware floorplanning
- Tapeout readiness: sign-off checklist ownership (timing, power, physical, reliability) and final GDS handoff
- Cross-team coordination: single point of contact between block-level PD owners, DV, DFT, package engineering, and architecture on all convergence-related tradeoffs and schedule risk
- Technical leadership: mentor block-level PD engineers on convergence best practices; set methodology and flow standards for chip-top closure across the program.
Requirements
- Master's degree in Electrical Engineering with 5+ years of industry experience or PhD in Electrical Engineering with 3+ years of industry experience
- 8-12+ years of physical design experience, with at least 2-3 full tapeouts at the chip-top/SoC integration level
- Deep hands-on experience with advanced nodes
- Proven track record owning full-chip timing closure across multiple corners/modes on a complex SoC
- Strong PDN/IR-drop/EM analysis experience (Voltus or equivalent)
- Experience with chip-level DFT integration (scan stitching, MBIST, JTAG)
- Familiarity with package co-design (flip-chip/BGA, C4 bumps, ball map) is a plus
- Demonstrated ability to lead technically without direct reports — driving alignment across multiple engineers and teams on convergence decisions
- Comfortable operating with significant ownership and ambiguity in a small, fast-moving team
- Experience with non-standard/novel architectures (dataflow, tiled, NoC-based) is a plus but not required
- Excellent scripting skills in TCL, shell and python.
Skills
- Innovus (or ICC2)
- Tempus/PrimeTime
- RedHawk
- Calibre
- TCL
- shell
- python
- computer architecture
- physical design
- ASIC implementation
- full chip sign off convergence
- circuit design
- device physics
- deep sub-micron technology
- physical design flow
- analog or mixed-signal macro integration
Experience Level
- 5+ years of industry experience (Master's)
- 3+ years of industry experience (PhD)
- 8-12+ years of physical design experience
Education Level
- Master's degree in Electrical Engineering
- PhD in Electrical Engineering
Salary/Compensations
- $200,000 to $250,000
Benefits
- Meaningful equity
- Comprehensive benefits
- 401K match
- Company-paid benefits
- Equity program
- Paid parental leave
- Flexibility
About the Company
- Efficient is developing the world’s most energy-efficient general-purpose computer processor.
- Efficient’s patented technology uses 100x less energy than state of the art commercially available ultra-low-power processors and is programmable using standard high-level programming languages and AI/ML frameworks.
- This level of efficiency makes perpetual, pervasive intelligence possible: run AI/ML continuously on a AA battery for 5-10 years.
- Our platform’s unprecedented level of efficiency enables IoT devices to intelligently capture and curate first-party data to drive the next major computing revolution.
- This is a unique opportunity to get in at the early stages of a hardware engineering organization and have influence on our products as we move from initial stages of product development to market release and scaled volume production.
- Join our team and help us shape the future of computing at the edge and beyond!
