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About the Role

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is responsible for powering Microsoft’s “Intelligent Cloud” mission by delivering core infrastructure and foundational technologies for Microsoft's online businesses. The Compute/AI Silicon & Manufacturing Engineering (CSME) organization designs, develops, manufactures, and packages Microsoft's computer chips, including Azure Cobalt & Maia. The Silicon, Manufacturing, and Packaging Engineering (SMPE) team is crucial for defining and delivering operational measures of success for hardware manufacturing, improving planning, quality, delivery, scale, and sustainability for Microsoft cloud hardware. We are seeking passionate engineers to envision and implement future technical solutions for managing and optimizing cloud infrastructure.

Responsibilities

Responsible for product/test engineering for new product development and manufacturing.
Drive pre-Si readiness for power, performance, Thermal and Power delivery (LDOs, Integrated VRs) related tests and features for successful bring up during power on.
Drive Power and Performance tuning during post-Si phase in partnership with platform teams.
Drive ATE test program implementation to optimize for SOC power/TDP.
Work closely with platform/system engineers to drive necessary correlation work to enable such optimizations.
Drive product manufacturing fuse requirements and end to end data flow for fusing across various test sockets.
Manage external vendors, drive cross functional teams, and drive sub-projects as part of larger development programs.
Develop ATE test programs, including test method development, test bring-up, characterization, debug, and yield analysis.
Manage product engineering from definition to launch.

Requirements

Experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging.
Strong project leadership skills.
Excellent knowledge of ATE test program development including test method development, test bring-up, characterization, debug, and yield analysis.
Knowledge of DFT, silicon fabrication process, product Q&R, and basic transistor theory.
Ability to meet Microsoft, customer and/or government security screening requirements.
Must pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Must provide proof of citizenship or US residency for assessment of eligibility to access export-controlled information.
Citizenship will be verified with a valid passport.
Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
8+ years of experience in Product development and manufacturing in large scale and/or high performance (i.e., AI, machine leaning, neural nets, CPU’s) and/or high power SoCs/chips.
8+ years of experience in Developing Integrated Circuits (pre-silicon, first silicon bring-up, new product introduction).
5+ years of experience in product and test engineering, specializing in ATE test program development.
Experience leading cross functional teams and understanding program/project management.
Experience managing supply chain, vendors / partners, and Integrated Circuit production.
Experience in system/customer requirements gathering and interfacing.
Experience with Si configuration (SKU) management and internal supplier/customer interfacing.
Experience with end-to-end product development flow and driving sample delivery milestones across the life cycle (Quality & Quantity).
Knowledgeable in power / performance modelling for ATE binning optimization in both pre- and post-silicon phases of the program.
In-depth understanding of ATE test program power/performance binning implementation including required characterization data collection.
Knowledgeable in yield recovery definition (redundancy and repair for logic, array, analog) and their implementation (test programs, test content, SKU).
Drive implementation partnering with cross-functional teams.
Electrical Engineering and/or Device physics background.
System and Platform validation background is a plus.
Experience working across various platforms (ATE/RVP/Customer boards) for product validation and characterization.
Experience with failure analysis, qualification, and yield analysis.
Probability and statistical background including DOE’s.
Experience in product and test engineering and ATE test program methodologies.
Advantest V93K experience is a plus.
Knowledgeable in DFT and DFM techniques.
Understanding of bring-up/debug, characterization/manufacturing test (on ATEs).
Device physics background.
Trusted Computer architecture fundamentals/background.
Unit/integration testing skills.
Background in debugging and optimizing software.

Skills

Power delivery
Performance tuning
ATE test program development
SOC power/TDP optimization
Product manufacturing fuse requirements
Cross-functional team leadership
Vendor management
Test method development
Test bring-up
Characterization
Debug
Yield analysis
DFT
Silicon fabrication process
Product Q&R
Transistor theory
High-performance computing
AI
GPUs
CPUs
Program/project management
Supply chain management
Vendor/partner management
Integrated Circuit production
System/customer requirements gathering
Si configuration (SKU) management
Power/performance modelling
ATE binning optimization
Yield recovery definition and implementation
Electrical Engineering
Device physics
System validation
Platform validation
Failure analysis
Qualification
Probability and statistics
DOE's
ATE test program methodologies
Advantest V93K
DFM techniques
Bring-up/debug
Manufacturing test
Trusted Computer architecture
Unit testing
Integration testing
Software debugging
Software optimization

Location

U.S.

Work Type

Full-time

Experience Level

Principal
3+ years technical engineering experience with Doctorate
6+ years technical engineering experience with Master's Degree
8+ years technical engineering experience with Bachelor's Degree
8+ years of experience in Product development and manufacturing
8+ years of experience in Developing Integrated Circuits
5+ years of experience in product and test engineering

Education Level

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field
Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field
Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field

Salary/Compensations

USD $142,800 - $274,800 per year (U.S. typical base pay range)
USD $188,000 - $304,200 per year (San Francisco Bay area and New York City metropolitan area)

Benefits

Certain roles may be eligible for benefits and other compensation.

About the Company

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission.
SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions.
Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide.
The Compute/AI Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt & Maia.
Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more.
As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance.
To achieve this goal, the Silicon, Manufacturing, and Packaging Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware.

Equal Opportunity

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances.
If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.