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About the Role

The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a data scientist to support Thermal Compression Bonding (TCB) process control, manufacturing data analytics, yield improvement, and predictive modeling. The successful candidate will collaborate with cross-functional teams to develop data-driven solutions that enhance process stability, reduce variation, and improve yield.

Responsibilities

• Analyze manufacturing, process, equipment, metrology, and yield data to identify trends, correlations, anomalies, and root causes of process variation.
• Develop and validate data analytics and machine learning models for process monitoring, excursion detection, yield prediction, defect pattern analysis, and tool health/process drift monitoring.
• Build proof-of-concepts to demonstrate the technical feasibility of predictive analytics and ML-based methods for TCB and related manufacturing applications.
• Define analytics requirements and translate manufacturing problems into scalable data solutions.
• Support advanced process control initiatives.
• Collaborate with manufacturing stakeholders to deploy practical solutions for production environments.
• Develop dashboards, reports, and automated analysis tools to improve decision-making and reaction time.
• Maintain a strong focus on data quality, model validity, and manufacturing relevance.

Requirements

• Bachelor's degree with 6+ years of relevant experience, or a Master's degree with 4+ years of relevant experience, or a PhD with 2+ years of relevant experience in Computer Science, Data Science, Statistics, Electrical Engineering, Industrial Engineering, Mechanical Engineering, or another relevant science or engineering discipline.
• Experience in manufacturing data analysis, statistical analysis, and applying data-driven methods to solve process or yield problems.
• Strong proficiency in Python programming and JMP for data analysis, automation, and model development.
• Experience working with large datasets from manufacturing, equipment, metrology, or quality systems.
• Demonstrated ability to apply AI/ML, statistical methods, or predictive modeling to extract actionable insights and support business or engineering decisions.
• Knowledge of SQL or other database query tools for data extraction and analysis.
• Experience in semiconductor manufacturing, preferably assembly / advanced packaging.
• Understanding of advanced process control (APC), including run-to-run control, SPC, excursion detection, and process monitoring.
• Experience with yield analysis, process capability improvement, and root cause investigation in a manufacturing environment.
• Familiarity with machine learning models for anomaly detection, prediction, clustering, or classification.
• Experience developing dashboards, reports, or analysis tools.
• Experience working with computer vision or automated inspection data is a plus.

Skills

• Python
• JMP
• SQL
• Data Analysis
• Statistical Analysis
• Machine Learning
• Predictive Modeling
• AI/ML
• Advanced Process Control (APC)
• Yield Analysis
• Root Cause Investigation
• Dashboard Development
• Reporting
• Computer Vision
• Automated Inspection

Location

• US, Arizona, Phoenix

Work Type

• On-site
• Experienced Hire

Experience Level

• 6+ years relevant experience (Bachelor's)
• 4+ years relevant experience (Master's)
• 2+ years relevant experience (PhD)

Education Level

• Bachelor's degree
• Master's degree
• PhD

Salary/Compensations

• $161,550.00 - $228,070.00 USD

Benefits

• Competitive pay
• Stock bonuses
• Health benefits
• Retirement benefits
• Vacation benefits

About the Company

• Join us at Intel to contribute to technological advancements while building a rewarding and impactful career. Apply now to be a part of our extraordinary journey.
• Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Equal Opportunity

• All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.