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Responsibilities

• Architect, design, and build the second generation hardware platform from concept to production.
• Own full system design including PCB layout, component selection, power management, and thermal management systems.
• Design and integrate thermoelectric cooling solutions with appropriate thermal control and monitoring.
• Develop cable assemblies and interconnect solutions for product reliability and manufacturability.
• Build robust, production-ready boards that can withstand real-world use and stress conditions.
• Establish hardware validation protocols including environmental stress testing, thermal cycling, and reliability testing.
• Work directly with overseas vendors and CMs for component sourcing, manufacturing, and quality control.
• Mentor and manage junior hardware engineers as the team grows.
• Ensure seamless integration between hardware, firmware, mobile apps, and backend services.
• Drive DFM (Design for Manufacturing) and cost optimization while maintaining quality standards.

Requirements

• 5+ years designing and shipping consumer electronics products.
• Hands-on experience with Realtek and STM32 microcontrollers and their ecosystems.
• Expertise in WiFi/BLE integration and RF debugging.
• Strong background in power electronics design and thermal management systems.
• Specific experience with thermoelectric cooling (Peltier) design and control.
• Proven ability to design robust, reliable boards for high-volume consumer products.
• Experience working with overseas suppliers and CMs across the full product lifecycle.
• Experience mentoring junior engineers and building technical teams.
• Track record of conducting comprehensive stress testing (thermal, vibration, drop, EMC).
• Firmware development experience (embedded C/C++, RTOS, driver development) is a strong plus.
• Experience owning complete hardware products end-to-end from concept through mass production is a strong plus.
• Experience taking consumer products through FCC/CE certification is preferred.

Skills

• PCB layout
• Component selection
• Power management
• Thermal management systems
• Thermoelectric cooling
• Cable assembly design
• Interconnect solutions
• Hardware validation
• Environmental stress testing
• Thermal cycling
• Reliability testing
• Component sourcing
• Manufacturing
• Quality control
• Hardware/firmware integration
• Hardware/mobile app integration
• Hardware/backend service integration
• DFM (Design for Manufacturing)
• Cost optimization
• Realtek microcontrollers
• STM32 microcontrollers
• WiFi integration
• BLE integration
• RF debugging
• Power electronics design
• Embedded C/C++
• RTOS
• Driver development
• FCC certification
• CE certification

Experience Level

• 5+ years