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About the Role
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.
Responsibilities
- Overall design responsibility for ASIC package designs, including signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with package engineering experts.
- Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
- Schedule, prioritize, and track work across 2+ projects simultaneously.
- General flip-chip BGA package design & engineering.
- Project management and customer interface for design projects.
- Contribute to efficiency improvements for the design team through process development/improvement, automation, and documentation.
- Physical design (layout) is a foundational responsibility.
Requirements
- BSEE or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 6+ years’ work experience.
- Knowledge of package-level signal integrity and power integrity.
- Cadence APD (allegro package designer) experience is preferred, or equivalent tool.
- Cooperate with a world-wide team, including co-design with internal team members and external (Vendor) designers.
- Self-management and organization skills.
- 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest is preferred.
Skills
- Signal integrity
- Power integrity
- Manufacturability
- Reliability
- Thermal management
- Flip-chip BGA package design
- High-speed SerDes
- Cadence APD
- Cadence SKILL
- Design automation
Location
- On-site
Work Type
- On-site
- Full-time
Experience Level
- 8+ years experience
- 6+ years experience
- 1+ years experience
Education Level
- BSEE or similar field
- MSEE or similar field
Salary/Compensations
- USD 121,900.00 To USD 195,000.00
Benefits
- Discretionary annual bonus
- Competitive new hire equity grant
- Annual equity awards
- Medical plans
- Dental plans
- Vision plans
- 401(K) participation with company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company paid holidays
- Paid sick leave
- Vacation time
- Paid Family Leave
- Other leaves of absence
About the Company
- Broadcom is proud to be an equal opportunity employer.
Equal Opportunity
- We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.
- We will also consider qualified applicants with arrest and conviction records consistent with local law.