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About the Role

The Package Development Engineer is responsible for developing, qualifying, and industrializing semiconductor package solutions that meet product performance, reliability, manufacturability, cost, and schedule requirements. This role works closely with cross-functional teams to bring new package technologies from concept through high-volume manufacturing.

Responsibilities

• Develop, qualify, and industrialize semiconductor package solutions.
• Collaborate with silicon design, package design, manufacturing, reliability, quality, and OSAT partners.
• Bring new package technologies from concept through high-volume manufacturing.

Requirements

• Bachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.
• Minimum 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.
• Strong knowledge of semiconductor assembly processes.
• Experience developing and qualifying semiconductor packages in collaboration with OSAT partners.
• Knowledge of Design of Experiments (DOE), statistical analysis, and structured problem-solving methodologies.
• Experience conducting package reliability testing, failure analysis, and root-cause investigations.
• Strong analytical, project management, and communication skills.
• Ability to work independently and effectively within cross-functional global teams.

Skills

• Wafer backgrind
• Wafer dicing
• Die attach
• Flip-chip assembly
• Wire bonding
• Underfill
• Encapsulation and molding
• Ball attach
• Package singulation
• Surface-mount technology (SMT)
• Flip-Chip CSP (FCCSP)
• System-in-Package (SiP)
• Fan-Out Packaging (FOPLP/FOWLP)
• Wafer-Level Packaging (WLP/WLCSP)
• 2.5D/3D Packaging
• Package thermal characterization
• Package mechanical characterization
• Package electrical characterization
• Automotive-grade product qualification
• Reliability standards
• Sustainability initiatives
• Packaging materials selection
• Cost optimization techniques
• Technical problem-solving
• Engineering rigor
• Attention to detail
• Innovation
• Research
• Project ownership
• Project execution
• Cross-functional leadership
• Vendor management
• Supplier management
• Technical communication

Location

• Remote Work Available: No

Work Type

• Regular (PERM)

Experience Level

• 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.
• Ph.D. - 2 plus years relevant industry experience
• Master's Degree - 5 plus years relevant industry experience
• Bachelor's Degree - 7 plus years relevant industry experience

Education Level

• Bachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.
• Master's degree or Ph.D. in Packaging Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or a related field.

Benefits

• Competitive benefits package

About the Company

• Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier.
• With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
• At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together.
• This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

Equal Opportunity

• Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law.
• For more information, please read our Diversity & Inclusion Statement.
• Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.