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About the Role

Tenstorrent is seeking a Layout Engineer with expertise in board layout for high-performance computing and AI hardware. This role requires direct experience with multi-layer boards, HDI vias, blind vias, back drilling, DFM, DFA and routing / layout of interfaces like GDDR, LPDDR, DDR, PCIe Gen 5 & 6, Ethernet IEEE 802.3bj, cd, cf, USB, etc. The ideal candidate will work closely with cross-functional teams consisting of engineers from systems, power, signal integrity and mechanical to ensure that our products meet the layout margins and cutting-edge specifications for mass production boards for data centers, workstations, and consumer computing applications.

Responsibilities

Own multi-layer PCB layouts for high-performance computing and AI hardware.
Route GDDR, LPDDR, DDR, PCIe Gen 5/6, Ethernet (IEEE 802.3bj/cd/cf), USB and other high-speed interfaces.
Choose appropriate advanced fabrication technologies (HDI, blind/buried vias, VIPPO, back drilling) balancing performance and cost.
Perform floorplanning, component placement, board connectivity, and creation of power/ground planes.
Collaborate with power, signal integrity, and mechanical engineers to meet PDN, SI, mechanical, thermal, and regulatory (IPC, UL, CE, RoHS, FCC) requirements.

Requirements

Experienced board layout engineer with ~8+ years in PCB design (Cadence Allegro; Altium a plus).
Hold a B.S. in EE, CS, or equivalent experience.
Strong background in high-speed, complex PCBs (high layer count, HDI, multi-lamination, VIPPO, back drilling).
Comfortable defining and applying layout rules (physical, spacing, length-matching) for high-speed designs.
Confident working with fabricators on stackups, capabilities, and resolving DFM/DFA/DFT feedback.
Detail-oriented owner of designs with strong communication skills and the ability to work with an international, cross-functional team.
Proficiency with Cadence schematic/layout tools (v25.1) in the Cadence Pulse environment.

Skills

Board layout
High-performance computing
AI hardware
Multi-layer boards
HDI vias
Blind vias
Back drilling
DFM
DFA
GDDR routing
LPDDR routing
DDR routing
PCIe Gen 5 & 6 routing
Ethernet IEEE 802.3bj routing
Ethernet cd routing
Ethernet cf routing
USB routing
Cadence Allegro
Altium
High-speed PCB design
Complex PCB design
HDI
Multi-lamination
VIPPO
Layout rules definition
Layout rules application
Fabricator collaboration
Stackup definition
DFM feedback resolution
DFA feedback resolution
DFT feedback resolution
Communication skills
Cross-functional team collaboration
Floorplanning
Component placement
Board connectivity
Power plane creation
Ground plane creation
PDN compliance
SI compliance
Mechanical compliance
Thermal compliance
Regulatory compliance (IPC, UL, CE, RoHS, FCC)

Location

Toronto, ON
Santa Clara, CA

Work Type

Hybrid

Experience Level

Various experience levels
~8+ years in PCB design

Education Level

B.S. in EE, CS, or equivalent experience

Salary/Compensations

$100k - $500k including base and variable compensation targets

Benefits

Highly competitive compensation package

About the Company

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency.
With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors.
Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible.
We value collaboration, curiosity, and a commitment to solving hard problems.
We are growing our team and looking for contributors of all seniorities.

Equal Opportunity

We are an equal opportunity employer.
This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology.
Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2).
These requirements apply to persons located in the U.S. and all countries outside the U.S.
As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.