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About the Role

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is responsible for powering Microsoft’s Intelligent Cloud mission by delivering core infrastructure and foundational technologies for Microsoft's online businesses. The Compute Silicon & Manufacturing Engineering (CSME) organization designs, develops, manufactures, and packages Microsoft's computer chips, including Azure Cobalt. The Signal and Power Integrity Team is crucial for defining and delivering operational measures of success for hardware manufacturing, improving planning, quality, delivery, scale, and sustainability for Microsoft cloud hardware. We are seeking a Principal Signal and Power Integrity Engineer to contribute to these efforts.

Responsibilities

Implement strategies for end-to-end design and analysis of D2D interfaces, HBM interfaces, system-level interfaces, and associated package technology decisions and tradeoffs.
Deliver SIPI solutions that meet HPC demands across the entire system.
Drive future SIPI solutions for chiplet architecture with advanced packaging and advanced silicon nodes.
Design, model, and simulate Signal and Power Integrity effects for data center processors and corresponding platforms to ensure optimized performance.
Perform DC, AC, and transient simulations to provide a comprehensive prediction of timing/noise margins and validate I/O performance from platform to silicon.
Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
Drive the execution of architecture solutions across product lines or multiple product groups, accounting for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned.
Drive engineering system design decisions requiring collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

Requirements

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
Ability to meet Microsoft, customer, and/or government security screening requirements.
Must pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Must provide proof of citizenship or US residency or other protected status for assessment of eligibility to access export-controlled information.
Citizenship will be verified with a valid passport; lawful permanent residents, refugees, and asylees may verify status using other documents.

Skills

Signal and Power Integrity
D2D interfaces
HBM interfaces
System-level interfaces
Package technology
High-Performance Computing (HPC)
Chiplet architecture
Advanced packaging
Advanced silicon nodes
DC simulation
AC simulation
Transient simulation
Timing margins
Noise margins
I/O performance
Silicon design
Platform architecture
Motherboard design
Package design
Thermal architecture
Power engineering
Performance engineering
System design
Electrical modeling
Foundry Silicon technologies
OSAT technologies
Substrate technologies

Location

U.S.

Work Type

Full-time

Experience Level

Principal
MSEE degree with 10 years’ experience
BSEE degree with minimum 10 years’ experience
minimum 7 years’ experience

Education Level

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field
Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field
Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field
MSEE degree
BSEE degree

Salary/Compensations

USD $142,800 - $274,800 per year (U.S. typical base pay range)
USD $188,000 - $304,200 per year (San Francisco Bay area and New York City metropolitan area)

Benefits

Certain roles may be eligible for benefits and other compensation.

About the Company

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission.
SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions.
Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide.
The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt.
Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more.

Equal Opportunity

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances.
If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.