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About the Role

The Central Hardware Systems (CHS) PCB CAD team designs cutting-edge printed circuit boards across Qualcomm's most strategic platforms. As a Senior PCB Designer, you will be a key contributor shaping next-generation hardware from concept through fabrication, working alongside world-class electrical and mechanical engineering teams.

Responsibilities

• Design and document high-density printed circuit board (PCB) layouts that conform to manufacturing and industry standards and Qualcomm design guidelines, using supplied schematics and electrical/mechanical design constraints
• Develop PCB layouts for a wide variety of 5G designs across multiple business units, including R&D, Mobile, Compute, IoT, Infrastructure, Automotive, and Test Equipment
• Support form factor accurate (FFA) test platform circuit boards requiring mastery of digital processors, RF, radio circuits, and power control devices
• Work with micro-vias (stacked), sequential lamination stack-ups, and design rules using 0.5mm pitch and smaller packages
• Collaborate with US and India-based teams to deliver PCB design solutions for high-performance electronic assemblies
• Develop and present PCB design trade-offs and solutions to the engineering design team for resolution and implementation
• Determine trade-offs necessary to meet design requirements while producing high-quality, cost-effective PCBs that meet schedule objectives
• Maintain technical coordination with Engineering and Manufacturing; resolve PCB design issues with fabrication and assembly vendors
• Prepare and deliver design reviews to project teams
• Contribute to process improvement initiatives, PCB and DFM checklists, and design guidelines
• Collaborate with internal PCB designers to optimize product development processes and schedule execution
• Provide direction, prioritization, and clear project task communication to team members and stakeholders
• Manage multiple projects simultaneously in a fast-paced, dynamic environment

Requirements

• 3+ years of active experience in PCB design for high-density electronics packaging
• 3+ years of experience in a PCB design role designing consumer-grade mobile products or low-volume test products utilizing latest-generation processor chips and ICs
• Proficiency in Siemens/Mentor Xpedition, PADS, Altium or Cadence Allegro PCB design software
• Experience with RF, Analog, and high-speed digital circuit design, including: DDR2/3/4/5, HDMI, PCIe, SATA, MIPI, USB 2.0/3.x, and GigE
• Expert understanding and demonstrated application of PCB design principles, practices, and industry standards
• Proven ability to perform complex PCB design tasks requiring in-depth knowledge of fabrication and assembly process capabilities and limitations
• Experience with EMI mitigation techniques and practices
• Experience with IDF/EMN file exchange between mechanical and hardware teams
• Familiarity with PWB technology and process trends and their application to advanced designs
• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools
• Strong verbal and written communication skills; ability to deliver clear status reports and presentations
• Effective collaboration with cross-functional engineering teams and external suppliers via email, web meetings, and instant messaging
• Ability to understand project goals and align individual contributions accordingly
• Leadership skills to direct, prioritize, and communicate project milestones to team members

Skills

• PCB design
• Siemens/Mentor Xpedition
• PADS
• Altium
• Cadence Allegro PCB design software
• RF
• Analog
• High-speed digital circuit design
• DDR2/3/4/5
• HDMI
• PCIe
• SATA
• MIPI
• USB 2.0/3.x
• GigE
• EMI mitigation
• IDF/EMN file exchange
• PWB technology
• DFM analysis
• Valor
• CAM350
• Communication skills
• Collaboration
• Leadership skills

Location

• San Diego, CA

Work Type

• Onsite

Experience Level

• 3+ years of active experience in PCB design for high-density electronics packaging
• 3+ years of experience in a PCB design role designing consumer-grade mobile products or low-volume test products utilizing latest-generation processor chips and ICs

Education Level

• Associate degree in Electronics, Electrical Technology, or a related technical field
• Bachelor’s degree in electrical engineering, electronics engineering technology, or a related technical field

Salary/Compensations

• $47.89 - $71.83

Benefits

• Competitive annual discretionary bonus program
• Opportunity for annual RSU grants
• Highly competitive benefits package

About the Company

• Qualcomm is a company of inventors that unlocked 5G & 6G, ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives.
• This is the Invention Age — and this is where you come in.

Equal Opportunity

• Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.