Technische*r Mitarbeiter*in - Verkapselungstechnik at Fraunhofer-Gesellschaft | DE | Rezi

Technische*r Mitarbeiter*in - Verkapselungstechnik at Fraunhofer-Gesellschaft

Technische*r Mitarbeiter*in - Verkapselungstechnik

Fraunhofer-Gesellschaft · DE

1 weeks ago

Technische*r Mitarbeiter*in - Verkapselungstechnik

Fraunhofer-Gesellschaft · DE

11 days ago
Resume preview

Impress employers and recruiters.
Choose from hundreds of resume examples.

Target Resume Now

About the Role

The AET group within Fraunhofer IZM focuses on innovative assembly, interconnection, and encapsulation technologies for reliable microelectronic systems. We work with high-performance materials for HPC modules and ensure reliable systems for automotive and industrial electronics.

Responsibilities

  • Support in the assembly of microelectronic structures
  • Analysis of manufactured modules
  • Process support in SMD soldering assembly and encapsulation
  • Documentation of manufacturing processes and assemblies (optical microscopy, X-ray analysis, etc.)
  • Technical support of machines (maintenance, setup, commissioning)

Requirements

  • Technical support of machines (maintenance, setup, commissioning)

Skills

  • SMD soldering assembly
  • Encapsulation
  • Optical microscopy
  • X-ray analysis

Location

  • Berlin, Germany

Work Type

  • Full-time

Experience Level

  • Entry-level

Education Level

  • Technical training or equivalent experience

About the Company

  • Fraunhofer Institute for Reliability and Microintegration IZM is a leading research institute in the field of assembly and interconnection technology for microelectronic systems.
  • The AET group is one of seven working groups in the 'System Integration and Interconnection Technologies' department.
  • We work with the most powerful materials on the development of modules for High Performance Computing.
  • We ensure the creation of highly reliable systems in vehicles and industrial electronics.