About the Role
The AET group within Fraunhofer IZM focuses on innovative assembly, interconnection, and encapsulation technologies for reliable microelectronic systems. We work with high-performance materials for HPC modules and ensure reliable systems for automotive and industrial electronics.
Responsibilities
- Support in the assembly of microelectronic structures
- Analysis of manufactured modules
- Process support in SMD soldering assembly and encapsulation
- Documentation of manufacturing processes and assemblies (optical microscopy, X-ray analysis, etc.)
- Technical support of machines (maintenance, setup, commissioning)
Requirements
- Technical support of machines (maintenance, setup, commissioning)
Skills
- SMD soldering assembly
- Encapsulation
- Optical microscopy
- X-ray analysis
Location
- Berlin, Germany
Work Type
- Full-time
Experience Level
- Entry-level
Education Level
- Technical training or equivalent experience
About the Company
- Fraunhofer Institute for Reliability and Microintegration IZM is a leading research institute in the field of assembly and interconnection technology for microelectronic systems.
- The AET group is one of seven working groups in the 'System Integration and Interconnection Technologies' department.
- We work with the most powerful materials on the development of modules for High Performance Computing.
- We ensure the creation of highly reliable systems in vehicles and industrial electronics.
