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About the Role

This role is accountable for end-to-end backend execution across HPC SoC and MCU programs, including implementation, signoff, and convergence from RTL to GDS. The position leads globally distributed engineering teams, ensuring high-quality silicon delivery on schedule and meeting PPA targets. It operates at the intersection of execution, technology enablement, and organizational leadership, driving consistency, scalability, and reliability across multiple sites and programs.

Responsibilities

Own full lifecycle delivery from RTL through physical implementation, signoff, and tape-out.
Ensure predictable execution, design closure, and milestone adherence across all programs.
Drive first-pass silicon success through robust methodologies and execution discipline.
Lead and scale large, geographically distributed backend engineering teams.
Establish clear accountability, performance standards, and delivery ownership across sites.
Build organizational capability to support multiple concurrent SoC and MCU programs.
Own delivery against defined power, performance, and area (PPA) targets.
Drive continuous improvement in cost, quality, and engineering efficiency.
Ensure adherence to quality standards, signoff criteria, and validation requirements.
Enable adoption of advanced process nodes and associated design methodologies.
Drive improvements in tools, flows, and engineering practices across implementation and signoff.
Partner with foundries, EDA vendors, and internal teams to enhance design outcomes.
Partner with architecture, RTL, DFT, methodology, and product engineering teams.
Ensure alignment between architectural intent and physical implementation feasibility.
Support program execution through close collaboration with program and product leadership.
Standardize ways of working across global teams to reduce variability and improve predictability.
Drive data-driven execution using metrics, KPIs, and performance tracking.
Identify and remove bottlenecks impacting delivery timelines or quality.

Requirements

Approximately 20+ years of experience in semiconductor design, with strong focus on physical design and implementation.
Proven experience leading large-scale, global engineering teams.
Demonstrated track record of delivering complex SoC programs across multiple technology nodes.
End-to-end RTL-to-GDSII flow, including synthesis, place and route, timing closure, and physical verification.
Advanced node implementation and signoff methodologies.
Deep understanding of SoC and MCU design and integration.
Ability to lead large, globally distributed teams in a matrixed environment.
Strong execution focus with accountability for delivery outcomes.
Effective cross-functional collaboration and stakeholder management.
Data-driven decision-making and structured problem-solving.
Experience in high-performance computing, automotive, or advanced SoC domains.
Exposure to methodology and flow development at scale.
Experience working across multiple geographies and cultures.

Skills

Physical design
Backend engineering
RTL to GDS execution
Implementation
Signoff
Convergence
Power, Performance, and Area (PPA) targets
Semiconductor design
SoC
MCU
Synthesis
Place and route
Timing closure
Physical verification
Advanced node implementation
Signoff methodologies
Methodology and flow development

Location

Global

Work Type

Regular (PERM)

Experience Level

Senior Director
20+ years

Benefits

Competitive benefits package

About the Company

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier.
With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together.
This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

Equal Opportunity

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.