About the Role
As an RF Design Engineer, you will play a key role in the development of next-generation optical communication products. Working within an international engineering team, you will lead RF design and development activities for optical subassemblies (OSAs) and optoelectronic modules, supporting cutting-edge coherent optical transceivers, photonic integrated circuit (PIC) technologies and advanced high-speed communication systems.
Responsibilities
- Lead RF design and development activities for optical subassemblies (OSAs) and optoelectronic modules supporting next-generation high-speed and terahertz communication products.
- Develop innovative RF interconnect and packaging concepts for coherent optical transceivers, PIC-based products and advanced optical modules.
- Design, simulate and optimise high-frequency RF transmission structures operating in the multi-gigahertz and terahertz frequency range, considering signal integrity, manufacturability, reliability and cost.
- Define RF specifications and interface requirements while coordinating technical requirements with cross-functional teams, suppliers and customers.
- Evaluate and optimise critical RF interfaces, including bump bonds, wire bonds, package transitions, substrates, PCBs and connector interfaces.
- Support Design for Manufacturing (DFM) activities with suppliers and manufacturing partners to ensure scalable and robust production solutions.
- Assess the impact of assembly processes and manufacturing tolerances on RF performance and product reliability.
- Present RF design concepts, simulation results and technical recommendations to engineering teams and management.
Requirements
- A Master's or PhD in Electrical Engineering, RF/Microwave Engineering, Physics or a related discipline.
- At least five years' experience in RF design and development, with a strong focus on microwave and millimetre-wave applications.
- Proven experience in RF transmission line design, impedance matching, signal integrity analysis and electromagnetic simulation.
- A strong understanding of high-frequency packaging technologies, including bump bonding, wire bonding and package transitions.
- Knowledge of optical transceiver architectures, optoelectronic packaging and substrate/PCB design.
- Experience using RF simulation and electromagnetic modelling tools such as AWR Microwave Office, CST Studio Suite or similar software.
- Familiarity with Design for Manufacturing (DFM) principles and supplier collaboration.
- Experience working with high-speed optical communication products, coherent optical technologies, PIC-based products or advanced packaging solutions would be advantageous.
- Strong analytical and problem-solving skills with the ability to communicate complex technical concepts effectively.
- Excellent English communication skills and the ability to work within multidisciplinary international teams.
- German language skills would be an advantage.
- Experience supporting technical customer discussions and supplier qualification activities.
- Familiarity with co-design approaches involving RF, optical, mechanical and manufacturing disciplines.
Skills
- RF design
- RF development
- Optical communication products
- Coherent optical transceivers
- Photonic integrated circuit (PIC) technologies
- High-speed communication systems
- RF interconnect design
- Packaging concepts
- High-frequency RF transmission structures
- Signal integrity
- Manufacturability
- Reliability
- Cost optimization
- RF specifications
- Interface requirements
- RF interfaces
- Bump bonds
- Wire bonds
- Package transitions
- Substrates
- PCBs
- Connector interfaces
- Design for Manufacturing (DFM)
- Assembly processes
- Manufacturing tolerances
- RF simulation
- Electromagnetic modelling
- AWR Microwave Office
- CST Studio Suite
- Analytical skills
- Problem-solving skills
- Technical communication
- English communication
- Multidisciplinary teamwork
- Customer discussions
- Supplier qualification
- Co-design
Location
- Germany
Work Type
- Full-time
Experience Level
- At least five years' experience in RF design and development
Education Level
- Master's or PhD in Electrical Engineering, RF/Microwave Engineering, Physics or a related discipline
Benefits
- Flexible working hours
- 30 days' annual leave, plus overtime entitlement
- Comprehensive health benefits, including additional health insurance or a fitness programme
- Financial support for public transport
- Bike leasing programme
- Performance bonus
- Company pension scheme
About the Company
- Finisar Germany GmbH, a Coherent subsidiary serves multiple businesses within Coherent.
- One focus area is the development of leading-edge high performance, high capacity optical front-end solutions for long reach optical transmission.
- A special field is utilizing advanced photonic technologies in support of driving highly integrated coherent products.
- Another focus area is high speed detectors, scaling up to frequencies of up to 100GHz, utilized in research and test & measurement but more and more in communication applications too.
- We owe our worldwide technological leadership to the profound knowledge and experience of our employees.
- This awareness characterizes our corporate culture - which is open and communicative and ensures trusting cooperation.
- Each individual contributes to the company's success with his or her knowledge and responsibility.
- The passion and commitment of our team are the engine of our company!
Equal Opportunity
- We are committed to creating an inclusive and accessible recruitment experience and encourage applications from individuals of all backgrounds.
