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About the Role

Universal Quantum is engineering the future of computing to create impactful quantum computers capable of solving previously impossible problems across healthcare, advanced materials, aerospace, and beyond. Expanding its engineering presence in Japan, the company seeks a Semiconductor Package Development Engineer to drive advanced semiconductor packaging solutions for next-generation quantum microchips, working at the intersection of materials science, microfabrication, and quantum technology.

Responsibilities

Initiate packaging concepts and drive advanced IC package development using ceramic package technology for next-generation quantum microchips.
Drive methodology, innovations, and productivity improvements in package development with internal teams and external vendors.
Develop packages for silicon testing in extreme environments, including cryogenic and low vacuum.

Requirements

PhD or senior expertise in mechanical engineering, material science, physics, packaging, micro/nanofabrication, or a similar field.

Skills

Business-level Japanese and English communication skills for technical discussions, documentation, and supplier interactions.
Package design and layout capabilities.
Semiconductor package experience.
Micro-assembly techniques and materials processing knowledge.
Proficiency in CAD tools and thermo-mechanical simulation.
Finite Element Modelling (FEM) for thermal, electrical, and mechanical simulations.
Experience with testing methodology for electro-mechanical testing of IC packaging.
Ability to implement 'Design for X' in package development.
Experience resolving package reliability issues, especially over a large temperature range.
Understanding of semiconductor assembly manufacturing.
Knowledge of packaging failure mechanisms and understanding mechanical and thermal stresses.
Strong general engineering problem-solving skills with robust engineering physics and fundamentals.
Knowledge of Through Silicon Via, silicon processing techniques, and thin film processing.
Experience with 2.5/3D packaging methods.
Electro-mechanical testing at cryo-temperatures.
Experience with low outgassing/ultra-high vacuum compatibility.
High voltage/power package qualifications.
Process engineering experience.
Advanced package assembly experience.

Location

Japan

Experience Level

Senior expertise

Education Level

PhD in mechanical engineering, material science, physics, packaging, micro/nanofabrication, or a similar field.

About the Company

Universal Quantum aims to engineer the future of computing to make the world a better place.
Creating impactful quantum computers capable of solving previously impossible problems.
Machines have applications across healthcare, advanced materials, aerospace, and beyond.